公开(公告)号：US10597512B2

公开(公告)日：2020-03-24

申请号：US15565116

申请日：2016-04-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Klaus Höhn ,  Kathy Schmidtke ,  Christina Keith

IPC: H01L33/00 ,  C08K5/05 ,  H01L33/56 ,  C08L83/04 ,  C08K5/02 ,  C08L83/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/58 ,  H01L33/64

Abstract: An optoelectronic device with a mixture including silicone and a fluoro-organic additive is disclosed. In an embodiment the device includes at least one radiation-emitting or radiation-detecting semiconductor and a mixture including silicone and a fluoro-organic additive. The mixture may be a component of at least one of the following elements: a package body element surrounding the at least one semiconductor at least in places, a radiation-guiding element arranged in a beam path of a radiation emitted by the semiconductor or detected by the semiconductor, a heat-conducting element configured to conduct heat emitted by the semiconductor or received by the semiconductor, or an adhesive element.

公开(公告)号：US20180100054A1

公开(公告)日：2018-04-12

申请号：US15565116

申请日：2016-04-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Klaus Höhn ,  Kathy Schmidtke ,  Christina Keith

IPC: C08K5/05 ,  H01L33/56 ,  H01L33/58 ,  H01L33/64 ,  H01L31/024 ,  H01L31/0232 ,  H01L31/0203 ,  C08L83/04

CPC classification number: C08K5/05 ,  C08K5/02 ,  C08L83/00 ,  C08L83/04 ,  C08L2203/206 ,  C08L2205/025 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/024 ,  H01L33/56 ,  H01L33/58 ,  H01L33/641 ,  H01L2224/32225 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0075

Abstract: An optoelectronic device with a mixture including silicone and a fluoro-organic additive is disclosed. In an embodiment the device includes at least one radiation-emitting or radiation-detecting semiconductor and a mixture including silicone and a fluoro-organic additive. The mixture may be a component of at least one of the following elements: a package body element surrounding the at least one semiconductor at least in places, a radiation-guiding element arranged in a beam path of a radiation emitted by the semiconductor or detected by the semiconductor, a heat-conducting element configured to conduct heat emitted by the semiconductor or received by the semiconductor, or an adhesive element.

公开(公告)号：US10263164B2

公开(公告)日：2019-04-16

申请号：US15549136

申请日：2016-02-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christina Keith ,  Kathy Schmidtke ,  Klaus Hoehn

IPC: C08L83/00 ,  C08G77/12 ,  H01L33/56 ,  C08G77/20 ,  C08L83/04 ,  C08K5/5435 ,  H01L33/48

Abstract: The present invention relates to an optoelectronic component comprising a semiconductor (1) and a polyorganosiloxane. The polyorganosiloxane is obtainable by crosslinking a composition comprising a first organosiloxane having at least one terminal vinyl group, a second organosiloxane having at least one silicon-hydrogen bond and an alkoxysilane having at least one epoxy group. Additionally specified is a method of producing an optoelectronic component.