公开(公告)号：US09224924B2

公开(公告)日：2015-12-29

申请号：US14347985

申请日：2012-09-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Klaus Hoehn ,  Reinhard Streitel

IPC: H01L33/48 ,  H01L31/02 ,  C09J163/00 ,  C08G59/62 ,  C08G59/68

CPC classification number: H01L33/48 ,  C08G59/62 ,  C08G59/687 ,  C09J163/00 ,  H01L24/73 ,  H01L31/02 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: An optoelectronic component includes at least one active semiconductor layer sequence, at least one first and one second element, and at least one adhesive layer arranged between at least one first element and at least one second element. The adhesive layer is produced from an adhesive that comprises at least a first monofunctional, difunctional or polyfunctional epoxy resin, an accelerator and an adhesion promoter.

Abstract translation: 光电子部件包括至少一个有源半导体层序列，至少一个第一和第二元件，以及布置在至少一个第一元件和至少一个第二元件之间的至少一个粘合剂层。 粘合剂层由至少包含第一单官能，双官能或多官能环氧树脂，促进剂和粘合促进剂的粘合剂制成。

公开(公告)号：US20140225148A1

公开(公告)日：2014-08-14

申请号：US14347985

申请日：2012-09-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Klaus Hoehn ,  Reinhard Streitel

IPC: H01L33/48 ,  H01L31/02

CPC classification number: H01L33/48 ,  C08G59/62 ,  C08G59/687 ,  C09J163/00 ,  H01L24/73 ,  H01L31/02 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: An optoelectronic component includes at least one active semiconductor layer sequence, at least one first and one second element, and at least one adhesive layer arranged between at least one first element and at least one second element. The adhesive layer is produced from an adhesive that comprises at least a first monofunctional, difunctional or polyfunctional epoxy resin, an accelerator and an adhesion promoter.

Abstract translation: 光电子部件包括至少一个有源半导体层序列，至少一个第一和第二元件，以及布置在至少一个第一元件和至少一个第二元件之间的至少一个粘合剂层。 粘合剂层由至少包含第一单官能，双官能或多官能环氧树脂，促进剂和粘合促进剂的粘合剂制成。

公开(公告)号：US10263164B2

公开(公告)日：2019-04-16

申请号：US15549136

申请日：2016-02-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christina Keith ,  Kathy Schmidtke ,  Klaus Hoehn

IPC: C08L83/00 ,  C08G77/12 ,  H01L33/56 ,  C08G77/20 ,  C08L83/04 ,  C08K5/5435 ,  H01L33/48

Abstract: The present invention relates to an optoelectronic component comprising a semiconductor (1) and a polyorganosiloxane. The polyorganosiloxane is obtainable by crosslinking a composition comprising a first organosiloxane having at least one terminal vinyl group, a second organosiloxane having at least one silicon-hydrogen bond and an alkoxysilane having at least one epoxy group. Additionally specified is a method of producing an optoelectronic component.

公开(公告)号：US20160307674A1

公开(公告)日：2016-10-20

申请号：US15101136

申请日：2014-12-02

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Klaus Hoehn ,  Luca Haiberger ,  Markus Wicke

IPC: H01C7/10 ,  H01L27/02 ,  H01L25/16 ,  H01C17/065 ,  H01L33/62

Abstract: A varistor paste includes a matrix material and particles embedded into the matrix material, wherein the matrix material without embedded particles has a viscosity of less than 0.8 Pa·s, and the embedded particles include varistor particles. An optoelectronic component includes an optoelectronic semiconductor chip and a varistor element connected in parallel with the optoelectronic semiconductor chip, wherein the varistor element includes a matrix material and particles embedded into the matrix material, the embedded particles include varistor particles, and the matrix material has a glass transition temperature of more than 130° C. A method of producing a varistor paste includes providing a matrix material having a viscosity of less than 0.8 Pa·s; and embedding particles into the matrix material to form a varistor paste, wherein the embedded particles include varistor particles.

Abstract translation: 压敏电阻糊包括基质材料和嵌入基质材料中的颗粒，其中不含嵌入颗粒的基体材料具有小于0.8Pa·s的粘度，并且嵌入的颗粒包括变阻器颗粒。 光电子部件包括与光电子半导体芯片并联连接的光电子半导体芯片和变阻器元件，其中，所述变阻器元件包括嵌入到所述基体材料中的基体材料和微粒，所述嵌入粒子包括变阻器粒子，所述基体材料具有 玻璃化转变温度大于130℃。制造非线性电阻糊的方法包括提供粘度小于0.8Pa·s的基质材料; 并将颗粒嵌入基质材料中以形成压敏胶浆，其中所述嵌入的颗粒包括变阻器颗粒。