Invention Grant
- Patent Title: Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards
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Application No.: US15282050Application Date: 2016-09-30
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Publication No.: US10263312B2Publication Date: 2019-04-16
- Inventor: Sasha N. Oster , Aleksandar Aleksov , Georgios C. Dogiamis , Telesphor Kamgaing , Adel A. Elsherbini , Shawna M. Liff , Johanna M. Swan , Brandon M. Rawlings , Richard J. Dischler
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01P3/12
- IPC: H01P3/12 ; H01P3/16 ; H01P11/00 ; H01P3/14
Abstract:
A method of making a waveguide ribbon that includes a plurality of waveguides comprises joining a first sheet of dielectric material to a first conductive sheet of conductive material, patterning the first sheet of dielectric material to form a plurality of dielectric waveguide cores on the first conductive sheet, and coating the dielectric waveguide cores with substantially the same conductive material as the conductive sheet to form the plurality of waveguides.
Public/Granted literature
- US20180097268A1 FABRICATION PROCESS FOR RIBBON BUNDLED MILLIMETER-WAVEGUIDE Public/Granted day:2018-04-05
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