Invention Grant
- Patent Title: Method of electrically contacting a bond pad of a device under test with a probe
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Application No.: US15222113Application Date: 2016-07-28
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Publication No.: US10267848B2Publication Date: 2019-04-23
- Inventor: Kenneth R. Smith
- Applicant: Cascade Microtech, Inc.
- Applicant Address: US OR Beaverton
- Assignee: FormFactor Beaverton, Inc.
- Current Assignee: FormFactor Beaverton, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Dascenzo Intellectual Property Law, P.C.
- Main IPC: H01R43/20
- IPC: H01R43/20 ; G01R31/28 ; G01R1/067 ; B32B38/10 ; G01R35/00 ; G01R1/073
Abstract:
The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.
Public/Granted literature
- US20160334465A1 METHOD OF REPLACING AN EXISTING CONTACT OF A WAFER PROBING ASSEMBLY Public/Granted day:2016-11-17
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