Invention Grant
- Patent Title: Plasma processing method
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Application No.: US15938006Application Date: 2018-03-28
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Publication No.: US10269539B2Publication Date: 2019-04-23
- Inventor: Kumiko Ono , Hiroshi Tsujimoto , Koichi Nagami
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2016-057010 20160322
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
In a plasma processing method includes a first stage of generating plasma of a first processing gas and a second stage of generating plasma of a second processing gas, are performed, a time difference between a start time point of a time period during which the second stage is performed and a start time point of an output of the second processing gas from a gas supply system is decided automatically according to a recipe. A delay time corresponding to flow rates of the first processing gas and the second processing gas in the second stage is specified from a function or a table.
Public/Granted literature
- US20180218882A1 PLASMA PROCESSING METHOD Public/Granted day:2018-08-02
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