- Patent Title: Semiconductor device package and a method of manufacturing the same
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Application No.: US15675612Application Date: 2017-08-11
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Publication No.: US10269771B2Publication Date: 2019-04-23
- Inventor: Li-Hao Lyu , Chieh-Ju Tsai , Yu-Kai Lin , Wei-Ming Hsieh , Yu-Pin Tsai , Man-Wen Tseng , Yu-Ting Lu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L23/28 ; H01L23/31 ; H01L23/427 ; H01L23/498 ; H01L23/00 ; H01L21/56 ; H01L23/538
Abstract:
A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.
Public/Granted literature
- US20180061727A1 SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-03-01
Information query
IPC分类:
