公开(公告)号：US10269771B2

公开(公告)日：2019-04-23

申请号：US15675612

申请日：2017-08-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hao Lyu ,  Chieh-Ju Tsai ,  Yu-Kai Lin ,  Wei-Ming Hsieh ,  Yu-Pin Tsai ,  Man-Wen Tseng ,  Yu-Ting Lu

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/28 ,  H01L23/31 ,  H01L23/427 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538

Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.