Invention Grant
- Patent Title: Memory component with on-die termination
-
Application No.: US16051291Application Date: 2018-07-31
-
Publication No.: US10270442B2Publication Date: 2019-04-23
- Inventor: Kyung Suk Oh , Ian P. Shaeffer
- Applicant: Rambus Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agent Charles Shemwell
- Main IPC: H03K17/16
- IPC: H03K17/16 ; H03K19/00 ; G06F3/06 ; G11C16/06 ; G11C11/417 ; G11C16/32 ; G11C11/413 ; G11C11/4063 ; G11C11/401 ; G11C11/41 ; G11C16/26 ; G11C11/419 ; H03K19/0175 ; G11C11/4093 ; G06F13/40

Abstract:
A memory control component outputs a memory write command to a memory IC and also outputs write data to be received via data inputs of the memory IC. Prior to reception of the write data within the memory IC, the memory control component asserts a termination control signal that causes the memory IC to apply to the data inputs a first on-die termination impedance during reception of the write data followed by a second on-die termination impedance after the write data has been received. The memory control component deasserts the termination control signal to cause the memory IC to apply no termination impedance to the data inputs.
Public/Granted literature
- US20190052269A1 ON-DIE TERMINATION CONTROL Public/Granted day:2019-02-14
Information query