Multiple patterning decomposition and manufacturing methods for IC
Abstract:
A multiple patterning decomposition method for IC is provided. Features of layout of IC are decomposed into a plurality of nodes. The nodes are classified to assign a plurality of first and second links between the nodes. First and second pseudo colors are assigned to a pair of nodes of each first link. The second links having a pair of nodes both corresponding to the first or second pseudo color are identified. The nodes of the first links are uncolored. A first real color is assigned to the two uncolored nodes of the identified second links in each of the networks. A second real color is assigned to the uncolored nodes connected to the nodes corresponding to the first real color through the first links. First and second masks are formed according to the nodes corresponding to the first and second real colors, respectively.
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