Invention Grant
- Patent Title: Laser machining device and laser machining method
-
Application No.: US14763267Application Date: 2013-11-29
-
Publication No.: US10276388B2Publication Date: 2019-04-30
- Inventor: Tsubasa Hirose , Yuu Takiguchi , Yasunori Igasaki , Hideki Shimoi
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2013-016973 20130131
- International Application: PCT/JP2013/082191 WO 20131129
- International Announcement: WO2014/119114 WO 20140807
- Main IPC: B23K26/53
- IPC: B23K26/53 ; B23K26/55 ; B23K26/38 ; H01L21/268 ; H01L21/67 ; B23K26/06 ; B23K26/00 ; B23K103/00

Abstract:
A laser processing apparatus 1 is an apparatus for forming a modified region R in an object to be processed S by irradiating the object S with laser light L. The laser processing apparatus 1 comprises a laser light source 2 that emits the laser light L, a mount table 8 that supports the object S, and an optical system 11 that converges a ring part surrounding a center part including an optical axis of the laser light L in the laser light L emitted from the laser light source 2 at a predetermined part of the object S supported by the mount table 8. The optical system 11 adjusts a form of at least one of inner and outer edges of the ring part of the laser light L according to a position of the predetermined part in the object S.
Public/Granted literature
- US20150343562A1 LASER MACHINING DEVICE AND LASER MACHINING METHOD Public/Granted day:2015-12-03
Information query
IPC分类: