Invention Grant
- Patent Title: Electric component assembly
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Application No.: US14422676Application Date: 2013-08-02
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Publication No.: US10278285B2Publication Date: 2019-04-30
- Inventor: Sebastian Brunner , Thomas Feichtinger
- Applicant: EPCOS AG
- Applicant Address: DE Munich
- Assignee: EPCOS AG
- Current Assignee: EPCOS AG
- Current Assignee Address: DE Munich
- Agency: Slater Matsil, LLP
- Priority: DE102012107668 20120821
- International Application: PCT/EP2013/066326 WO 20130802
- International Announcement: WO2014/029602 WO 20140227
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01C1/01 ; H01C1/084 ; H01C7/00 ; H01C7/02 ; H01C7/04 ; H01C7/102 ; H05K1/03 ; H05K1/18 ; H05K1/02

Abstract:
A component assembly is disclosed. In an embodiment the assembly includes a carrier, a metallic structure arranged on the carrier, wherein the metallic structure comprises at least one cavity and an electrical component arranged at least in part in the cavity, wherein the metallic structure comprises at least two part regions which are not connected to each other by any further part of the metallic structure, and wherein the cavity is located between the two part regions. The assembly further includes two contact areas located on the carrier, wherein the component is located on the two contact areas such that each part region of the two part regions is located on one of the two contact areas.
Public/Granted literature
- US20150245481A1 Electric Component Assembly Public/Granted day:2015-08-27
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