公开(公告)号：US20200168371A1

公开(公告)日：2020-05-28

申请号：US16594073

申请日：2019-10-07

Applicant: Chung-Lin LIU ,  Chien-Hsin HUANG ,  Wen-Chung CHEN

Inventor： Chung-Lin LIU ,  Chien-Hsin HUANG ,  Wen-Chung CHEN

IPC: H01C1/14 ,  H01C1/084

Abstract: Herein disclosed is a resistor comprising a resistance bar and a plurality of dividing connectors. The resistance bar has a first end and a second end and provides a first current path, which stretches from the first end to the second end along the resistance bar. The distance between the first end and the second end is less than the length of the first current path. The first and second ends are configured to be electrically connected to a power source. The dividing connectors are electrically connected to different locations on the first current path. Each of the dividing connectors has a contact pad. The resistance bar is not coplanar with the contact pads. A divided voltage is obtained from a pair of dividing connectors chosen from the plurality of dividing connectors.

公开(公告)号：US10438729B2

公开(公告)日：2019-10-08

申请号：US16181006

申请日：2018-11-05

Applicant: Vishay Dale Electronics, LLC

Inventor： Todd L. Wyatt ,  Darin W. Glenn

IPC: H01C1/084 ,  H01C1/034 ,  H01C17/02 ,  H01C1/01 ,  H01C17/28 ,  H01C1/148 ,  C22C9/00

Abstract: Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.

公开(公告)号：US10319501B2

公开(公告)日：2019-06-11

申请号：US15107079

申请日：2015-02-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masaaki Itou

IPC: H01C1/08 ,  H01C1/084 ,  G01R1/20 ,  H01C1/028 ,  H01C7/00 ,  H01C7/06 ,  H01C1/14

Abstract: A chip resistor includes a resistive element, a pair of electrodes, and heat radiator plates. The resistive element is made of a plate-shaped metal. The pair of electrodes is formed on both ends of a first surface of the resistive element. The heat radiator plates are fastened to a second surface of the resistive element and are disposed spaced apart from each other via a gap therebetween.

公开(公告)号：US09930769B2

公开(公告)日：2018-03-27

申请号：US14181187

申请日：2014-02-14

Applicant: QUALCOMM Incorporated

Inventor： Arpit Mittal ,  Alvin Leng Sun Loke ,  Mehdi Saeidi ,  Patrick Drennan

IPC: H01L29/00 ,  H05K1/02 ,  H01C1/08 ,  H01C1/01 ,  H01L49/02 ,  H01C1/084 ,  H01L23/522 ,  H01L23/367

CPC classification number: H05K1/0204 ,  H01C1/01 ,  H01C1/08 ,  H01C1/084 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/5228 ,  H01L28/20 ,  H01L28/24 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.

公开(公告)号：US20180012685A1

公开(公告)日：2018-01-11

申请号：US15544126

申请日：2016-01-27

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Toshiyuki Nagase ,  Masahito Komasaki

IPC: H01C1/144 ,  H01C7/00 ,  H01C1/084 ,  H01C17/00 ,  H01C1/012

CPC classification number: H01C1/144 ,  H01C1/012 ,  H01C1/028 ,  H01C1/084 ,  H01C7/003 ,  H01C17/006 ,  H01C17/02 ,  H01C17/28

Abstract: The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an Al—Si-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of −30 μm/50 mm to 700 μm/50 mm.

公开(公告)号：US20150042444A1

公开(公告)日：2015-02-12

申请号：US14473118

申请日：2014-08-29

Applicant: Clark Smith ,  Todd Wyatt

Inventor： Clark Smith ,  Todd Wyatt

IPC: H01C1/084 ,  H01C17/28 ,  H01C1/14

CPC classification number: H01C1/084 ,  H01C1/14 ,  H01C1/148 ,  H01C7/003 ,  H01C17/28 ,  Y10T29/49082 ,  Y10T29/49101

Abstract: A resistor and an integrated heat spreader are provided. A resistive element having a first surface is in contact with electrically conducting terminals. A heat spreader is provided having at least a portion in thermally conductive contact with at least a portion of the first surface of the resistive element. The heat spreader comprising a thermally conducting and electrically insulating material, and has terminations, each termination adjacent to one of the electrically conducting terminals. Each termination is in thermally conducting contact with the adjacent electrically conducting terminal. A method of fabricating a resistor and an integrated heat spreader is also provided.

Abstract translation: 提供电阻器和集成散热器。 具有第一表面的电阻元件与导电端子接触。 散热器具有与电阻元件的第一表面的至少一部分导热接触的至少一部分。 散热器包括导热和电绝缘材料，并且具有端子，每个端子与导电端子之一相邻。 每个终端与相邻的导电端子进行导热接触。 还提供了制造电阻器和集成散热器的方法。

公开(公告)号：US08881379B2

公开(公告)日：2014-11-11

申请号：US13460871

申请日：2012-05-01

Applicant: Douglas D. Coolbaugh ,  Ebenezer E. Eshun ,  Terence B. Hook ,  Robert M. Rassel ,  Edmund J. Sprogis ,  Anthony K. Stamper ,  William J. Murphy

Inventor： Douglas D. Coolbaugh ,  Ebenezer E. Eshun ,  Terence B. Hook ,  Robert M. Rassel ,  Edmund J. Sprogis ,  Anthony K. Stamper ,  William J. Murphy

IPC: H05B3/00 ,  H01C1/084 ,  H01C7/10

CPC classification number: H01C7/1013 ,  H01C1/084 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49099 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

Abstract: A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor.

Abstract translation: 提供带散热片的电阻。 散热器包括具有导热性高的金属或其它热导体的导电路径。 为了避免使用热导体将电阻器短路接地，在热导体和电阻体之间插入有一层薄导电电绝缘体。 因此，电阻器可承载大量的电流，因为高导电性热导体将热量从电阻器传导到散热器。 除了降低寄生电容和其他寄生电效应之外，提供各种配置的导热体和散热片，提供良好的导热性能，这将降低电阻器的高频响应。

公开(公告)号：US20140176294A1

公开(公告)日：2014-06-26

申请号：US13725018

申请日：2012-12-21

Applicant: Clark Smith ,  Todd Wyatt

Inventor： Clark Smith ,  Todd Wyatt

IPC: H01C1/084 ,  H01C17/00

CPC classification number: H01C1/084 ,  H01C1/14 ,  H01C1/148 ,  H01C7/003 ,  H01C17/28 ,  Y10T29/49082 ,  Y10T29/49101

Abstract: An integrated assembly includes a resistor and a heat spreader. The resistor includes a resistive element and terminals. The heat spreader is integrated with the resistor and includes a heat sink of thermally conducting and electrically insulating material and terminations of a thermally conducting material and situated at an edge of the heat sink. At least a portion of a top surface of the resistive element is in thermally conductive contact with the heat sink. Each resistor terminal is in thermally conductive contact with a corresponding termination of the heat sink. A method of fabricating an integrated assembly of a resistor and a heat spreader includes forming the heat spreader, forming the resistor, and joining the heat spreader to the resistor by bonding at least a portion of a top surface of the resistive element to the heat sink and bonding each electrically conducting terminal to a corresponding termination.

Abstract translation: 集成组件包括电阻器和散热器。 电阻器包括电阻元件和端子。 散热器与电阻器集成，并且包括导热和电绝缘材料的散热器和导热材料的端子并且位于散热器的边缘处。 电阻元件的顶表面的至少一部分与散热器导热接触。 每个电阻端子与散热器的相应端子进行导热接触。 一种制造电阻器和散热器的集成组件的方法包括形成散热器，形成电阻器，以及通过将电阻元件的顶表面的至少一部分接合到散热器而将散热器连接到电阻器 并将每个导电端子接合到相应的端接件。

公开(公告)号：US20050212649A1

公开(公告)日：2005-09-29

申请号：US11123508

申请日：2005-05-05

Applicant: Greg Schneekloth ,  Nathan Welk ,  Brandon Traudt ,  Joel Smejkal ,  Ronald Miksch ,  Steve Hendricks ,  David Lange

Inventor： Greg Schneekloth ,  Nathan Welk ,  Brandon Traudt ,  Joel Smejkal ,  Ronald Miksch ,  Steve Hendricks ,  David Lange

IPC: H01C1/084 ,  H01C7/06 ,  H01C13/00

CPC classification number: H01C1/084 ,  H01C7/06 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49087 ,  Y10T29/49099 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49162

Abstract: A high power resistor includes a resistance element with first and second leads extending out from the opposite ends thereof. A heat sink of dielectric material is in heat conducting relation to the resistance element. The heat conducting relationship of the resistance element and the heat sink render the resistance element capable of operating as a resistor between the temperatures of −65° C. to +275° C. The heat sink is adhered to the resistance element and a molding compound is molded around the resistance element.

Abstract translation: 高功率电阻器包括具有从其相对端延伸出的第一和第二引线的电阻元件。 电介质材料的散热片与电阻元件导热。 电阻元件和散热片的导热关系使得电阻元件能够在-65℃至+ 275℃的温度之间作为电阻器工作。散热器粘附到电阻元件和模制化合物 围绕电阻元件模制。

公开(公告)号：US06925704B1

公开(公告)日：2005-08-09

申请号：US10744846

申请日：2003-12-23

Applicant: Greg Schneekloth ,  Nathan Welk ,  Brandon Traudt ,  Joel Smejkal ,  Ronald J. Miksch ,  Steve Hendricks ,  David L. Lange

Inventor： Greg Schneekloth ,  Nathan Welk ,  Brandon Traudt ,  Joel Smejkal ,  Ronald J. Miksch ,  Steve Hendricks ,  David L. Lange

IPC: H01C1/084 ,  H01C7/06 ,  H01C17/00

CPC classification number: H01C1/084 ,  H01C7/06 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49087 ,  Y10T29/49099 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49162

Abstract: A high power resistor includes a resistance element with first and second leads extending out from the opposite ends thereof. A heat sink of dielectric material is in heat conducting relation to the resistance element. The heat conducting relationship of the resistance element and the heat sink render the resistance element capable of operating as a resistor between the temperatures of −65° C. to +275° C. The heat sink is adhered to the resistance element and a molding compound is molded around the resistance element.

Abstract translation: 高功率电阻器包括具有从其相对端延伸出的第一和第二引线的电阻元件。 电介质材料的散热片与电阻元件导热。 电阻元件和散热片的导热关系使得电阻元件能够在-65℃至+ 275℃的温度之间作为电阻器工作。散热器粘附到电阻元件和模制化合物 围绕电阻元件模制。