Invention Grant
- Patent Title: Skewed co-spiral inductor structure
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Application No.: US14991803Application Date: 2016-01-08
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Publication No.: US10283257B2Publication Date: 2019-05-07
- Inventor: Daeik Daniel Kim , David Francis Berdy , Chengjie Zuo , Changhan Hobie Yun , Jonghae Kim
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated/Seyfarth Shaw LLP
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H01F41/04 ; H04B1/40 ; H01L23/522 ; H01L27/02 ; H01L49/02

Abstract:
A skewed, co-spiral inductor structure may include a first trace arranged in a first spiral pattern that is supported by a substrate. The skewed, co-spiral inductor structure may also include a second trace arranged in a second spiral pattern, in which the second trace is coupled to the first trace. The first trace may overlap with the second trace in orthogonal overlap areas. In addition, each orthogonal overlap area may have a size defined by a width of the first trace and the width of the second trace. Also, parallel edges of the first trace and the second trace may be arranged to coincide.
Public/Granted literature
- US20170200550A1 SKEWED CO-SPIRAL INDUCTOR STRUCTURE Public/Granted day:2017-07-13
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