Invention Grant
- Patent Title: High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella
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Application No.: US15595773Application Date: 2017-05-15
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Publication No.: US10283317B2Publication Date: 2019-05-07
- Inventor: Paul Keady , Brennan Peterson , Guus Das , Craig Matthew Henry , Larry Dworkin , Jeff Blackwood , Stacey Stone , Michael Schmidt
- Applicant: FEI Company
- Applicant Address: US OR Hillsboro
- Assignee: FEI Company
- Current Assignee: FEI Company
- Current Assignee Address: US OR Hillsboro
- Agent Denton W. McAlister
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H01J37/305 ; C23C14/58 ; C23F1/02 ; H01J37/28 ; G01N1/32 ; H01J37/30 ; H01J37/20
Abstract:
A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.
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