Invention Grant
- Patent Title: Integration methods to fabricate internal spacers for nanowire devices
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Application No.: US16153456Application Date: 2018-10-05
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Publication No.: US10283589B2Publication Date: 2019-05-07
- Inventor: Seiyon Kim , Kelin J. Kuhn , Tahir Ghani , Anand S. Murthy , Mark Armstrong , Rafael Rios , Abhijit Jayant Pethe , Willy Rachmady
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/306 ; H01L21/3105 ; H01L21/3115 ; H01L29/08 ; H01L29/423 ; H01L29/786 ; H01L29/66 ; H01L29/78 ; B82Y40/00

Abstract:
A nanowire device having a plurality of internal spacers and a method for forming said internal spacers are disclosed. In an embodiment, a semiconductor device comprises a nanowire stack disposed above a substrate, the nanowire stack having a plurality of vertically-stacked nanowires, a gate structure wrapped around each of the plurality of nanowires, defining a channel region of the device, the gate structure having gate sidewalls, a pair of source/drain regions on opposite sides of the channel region; and an internal spacer on a portion of the gate sidewall between two adjacent nanowires, internal to the nanowire stack. In an embodiment, the internal spacers are formed by depositing spacer material in dimples etched adjacent to the channel region. In an embodiment, the dimples are etched through the channel region. In another embodiment, the dimples are etched through the source/drain region.
Public/Granted literature
- US20190051725A1 INTEGRATION METHODS TO FABRICATE INTERNAL SPACERS FOR NANOWIRE DEVICES Public/Granted day:2019-02-14
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