Invention Grant
- Patent Title: Temperature sensitive location error compensation
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Application No.: US14676571Application Date: 2015-04-01
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Publication No.: US10288409B2Publication Date: 2019-05-14
- Inventor: Yuval Gronau , Chun-Hsiang Yen , Barak Dee-Noor
- Applicant: APPLIED MATERIALS ISRAEL LTD.
- Applicant Address: IL Rehovot
- Assignee: APPLIED MATERIALS ISRAEL LTD.
- Current Assignee: APPLIED MATERIALS ISRAEL LTD.
- Current Assignee Address: IL Rehovot
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: G01B11/02
- IPC: G01B11/02 ; G01B11/00 ; F16M11/42 ; H01L21/67 ; H01L21/687

Abstract:
A system that may include a movable support module for supporting an object and a controller, wherein the controller is configured to: receive an estimated location of a movable support module that supports an object and temperature information about an actual or estimated temperature of at least a portion of the object support module; and calculate movable support module location information, in response to (a) the estimated location of the movable support module, (b) the temperature information, and (c) a mapping between (i) values of the temperature information, (ii) estimated locations of the movable support module, and (iii) location errors of the movable support module.
Public/Granted literature
- US20160290786A1 TEMPERATURE SENSITIVE LOCATION ERROR COMPENSATION Public/Granted day:2016-10-06
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