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    Temperature sensitive location error compensation
    3.
    发明授权
    Temperature sensitive location error compensation 有权

    公开(公告)号：US10288409B2

    公开(公告)日：2019-05-14

    申请号：US14676571

    申请日：2015-04-01

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Yuval Gronau ,  Chun-Hsiang Yen ,  Barak Dee-Noor

    IPC: G01B11/02 ,  G01B11/00 ,  F16M11/42 ,  H01L21/67 ,  H01L21/687

    Abstract: A system that may include a movable support module for supporting an object and a controller, wherein the controller is configured to: receive an estimated location of a movable support module that supports an object and temperature information about an actual or estimated temperature of at least a portion of the object support module; and calculate movable support module location information, in response to (a) the estimated location of the movable support module, (b) the temperature information, and (c) a mapping between (i) values of the temperature information, (ii) estimated locations of the movable support module, and (iii) location errors of the movable support module.

    Review of suspected defects using one or more reference dies
    5.
    发明授权
    Review of suspected defects using one or more reference dies 有权

    公开(公告)号：US09673022B2

    公开(公告)日：2017-06-06

    申请号：US14798153

    申请日：2015-07-13

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Ofir Greenberg ,  Yuval Gronau

    IPC: G01N21/88 ,  H01J37/22 ,  H01J37/28

    CPC classification number: H01J37/222 ,  H01J37/28 ,  H01J2237/2813 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

    Abstract: A system for reviewing a wafer, the system may include a memory unit that is configured to store information about locations of a set of suspected defects that are located at multiple dice of the wafer; electron optics that is configured to obtain images of reference elements, wherein the reference elements are located within a first reference die of the wafer; and a processor that is configured to: compare the first sub-set of suspected defects to a first sub-set of reference elements to provide a first evaluation result; and select, in response to the first evaluation result, a source of a second sub-set of reference elements. The electron optics is further configured to obtain images of a second sub-set of reference elements that are located within a second reference die of the wafer when it is determined that the second reference die is the source of the second sub-set of reference elements. The processor is further configured to compare the second sub-set of suspected defects to the second sub-set of reference elements to provide a second evaluation result.

    SYSTEM AND METHOD FOR SETTING A TEMPERATURE OF AN OBJECT WITHIN A CHAMBER
    6.
    发明申请
    SYSTEM AND METHOD FOR SETTING A TEMPERATURE OF AN OBJECT WITHIN A CHAMBER 审中-公开
    用于设置室内物体的温度的系统和方法

    公开(公告)号：US20170011882A1

    公开(公告)日：2017-01-12

    申请号：US14795795

    申请日：2015-07-09

    Applicant: Applied Materials Israel, Ltd.

    Inventor： Chun-Hsiang Yen ,  Barak Dee-Noor ,  Yuval Gronau ,  Ronen Hagai ,  Efim Vinnitsky ,  Yohanan Madmon

    IPC: H01J37/24 ,  H01J37/20 ,  H05K7/20

    CPC classification number: H01J37/24 ,  G03F7/70875 ,  H01J37/20 ,  H01J2237/002 ,  H01J2237/20278 ,  H01L21/67248 ,  H01L21/68 ,  H01L22/12

    Abstract: A system that may include a chamber, a motorized system, a chuck, a controller, multiple temperature sensors and a cooling module; wherein the chuck is configured to support an object that is positioned within the chamber; wherein the motorized system is configured to move the chuck in relation to the chamber; wherein the multiple temperature sensors are configured to sense multiple temperatures of at least one point within the chamber; wherein the cooling module is configured to cool a unit of the motorized system; and wherein the controller is configured to control the cooling module in response to the multiple temperatures.

    Abstract translation: 可以包括室，电动系统，卡盘，控制器，多个温度传感器和冷却模块的系统; 其中所述卡盘被构造成支撑位于所述腔室内的物体; 其中所述电动系统被配置成相对于所述室移动所述卡盘; 其中所述多个温度传感器被配置为感测所述室内的至少一个点的多个温度; 其中所述冷却模块被配置为冷却所述电动系统的单元; 并且其中所述控制器被配置为响应于所述多个温度来控制所述冷却模块。

    System and method for scanning an object
    7.
    发明授权
    System and method for scanning an object 有权
    用于扫描对象的系统和方法

    公开(公告)号：US09490101B2

    公开(公告)日：2016-11-08

    申请号：US14658993

    申请日：2015-03-16

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Yuval Gronau ,  Ishai Schwarzband ,  Benzion Sender ,  Dror Shemesh ,  Ran Schleyen ,  Ofir Greenberg

    IPC: G01N23/00 ,  H01J37/22 ,  H01J37/28

    CPC classification number: H01J37/222 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/221 ,  H01J2237/24592 ,  H01J2237/2803

    Abstract: A system for scanning an object, the system may include (a) charged particles optics that is configured to: scan, with a charged particle beam and at a first scan rate, a first region of interest (ROI) of an area of the object; detect first particles that were generated as a result of the scanning of the first ROI; scan, with the charged particle beam and at a second scan rate, a second ROI of the area of the object; wherein the second scan rate is lower than the first scan rate; wherein first ROI differs from the second ROI by at least one parameter; detect second particles that were generated as a result of the scanning of the second ROA; and (b) a processor that is configured to generate at least one image of the area in response to the first and second particles.

    Abstract translation: 一种用于扫描对象的系统，系统可以包括（a）带电粒子光学器件，其被配置为：以带电粒子束和第一扫描速率扫描物体的区域的第一感兴趣区域（ROI） ; 检测由于第一ROI的扫描而产生的第一粒子; 用所述带电粒子束以第二扫描速率扫描所述物体区域的第二ROI; 其中所述第二扫描速率低于所述第一扫描速率; 其中第一ROI与所述第二ROI相差至少一个参数; 检测由于第二ROA的扫描而产生的第二颗粒; 以及（b）处理器，被配置为响应于所述第一和第二粒子而产生所述区域的至少一个图像。

    SYSTEM AND METHOD FOR SCANNING AN OBJECT
    8.
    发明申请
    SYSTEM AND METHOD FOR SCANNING AN OBJECT 有权
    用于扫描对象的系统和方法

    公开(公告)号：US20160276127A1

    公开(公告)日：2016-09-22

    申请号：US14658993

    申请日：2015-03-16

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Yuval Gronau ,  Ishai Schwarzband ,  Benzion Sender ,  Dror Shemesh ,  Ran Schleyen ,  Ofir Greenberg

    IPC: H01J37/22 ,  H01J37/28

    CPC classification number: H01J37/222 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/221 ,  H01J2237/24592 ,  H01J2237/2803

    Abstract: A system for scanning an object, the system may include (a) charged particles optics that is configured to: scan, with a charged particle beam and at a first scan rate, a first region of interest (ROI) of an area of the object; detect first particles that were generated as a result of the scanning of the first ROI; scan, with the charged particle beam and at a second scan rate, a second ROI of the area of the object; wherein the second scan rate is lower than the first scan rate; wherein first ROI differs from the second ROI by at least one parameter; detect second particles that were generated as a result of the scanning of the second ROA; and (b) a processor that is configured to generate at least one image of the area in response to the first and second particles.

    Abstract translation: 一种用于扫描对象的系统，系统可以包括（a）带电粒子光学器件，其被配置为：以带电粒子束和第一扫描速率扫描物体的区域的第一感兴趣区域（ROI） ; 检测由于第一ROI的扫描而产生的第一粒子; 用所述带电粒子束以第二扫描速率扫描所述物体区域的第二ROI; 其中所述第二扫描速率低于所述第一扫描速率; 其中第一ROI与所述第二ROI相差至少一个参数; 检测由于第二ROA的扫描而产生的第二颗粒; 以及（b）处理器，被配置为响应于所述第一和第二粒子而产生所述区域的至少一个图像。

    Imaging low electron yield regions with a charged beam imager
    9.
    发明授权
    Imaging low electron yield regions with a charged beam imager 有权

    公开(公告)号：US10103005B2

    公开(公告)日：2018-10-16

    申请号：US14795877

    申请日：2015-07-09

    Applicant: Applied Materials Israel Ltd.

    Inventor： Yuval Gronau ,  Ishai Schwarzband ,  Barak Dee-Noor

    IPC: H04N7/18 ,  H01J37/22 ,  H01J37/26 ,  H01J37/28 ,  G06T7/00

    Abstract: Disclosed herein are a system and method for imaging low electron yield regions with a charged beam imager. In certain embodiments, a system may include a processor, wherein the processor comprise an image waveform finder, a synthetic image generator and an output image generator; wherein the processor is configured to (i) receive or generate multiple images of a region of the object; wherein the region has an electron yield that is below an electron yield threshold; (ii) process the multiple images to generate multiple synthetic images, and (iii) generate an output image of the region in response to the multiple synthetic images.

    REVIEW OF SUSPECTED DEFECTS USING ONE OR MORE REFERENCE DIES
    10.
    发明申请
    REVIEW OF SUSPECTED DEFECTS USING ONE OR MORE REFERENCE DIES 有权
    使用一个或多个参考文件来检查可疑的缺陷

    公开(公告)号：US20170018398A1

    公开(公告)日：2017-01-19

    申请号：US14798153

    申请日：2015-07-13

    Applicant: APPLIED MATERIALS ISRAEL LTD.

    Inventor： Ofir Greenberg ,  Yuval Gronau

    IPC: H01J37/22 ,  H01J37/28

    CPC classification number: H01J37/222 ,  H01J37/28 ,  H01J2237/2813 ,  H01J2237/2817 ,  H01L22/12 ,  H01L22/20

    Abstract: A system for reviewing a wafer, the system may include a memory unit that is configured to store information about locations of a set of suspected defects that are located at multiple dice of the wafer; electron optics that is configured to obtain images of reference elements, wherein the reference elements are located within a first reference die of the wafer; and a processor that is configured to: compare the first sub-set of suspected defects to a first sub-set of reference elements to provide a first evaluation result; and select, in response to the first evaluation result, a source of a second sub-set of reference elements. The electron optics is further configured to obtain images of a second sub-set of reference elements that are located within a second reference die of the wafer when it is determined that the second reference die is the source of the second sub-set of reference elements. The processor is further configured to compare the second sub-set of suspected defects to the second sub-set of reference elements to provide a second evaluation result.

    Abstract translation: 一种用于检查晶片的系统，所述系统可以包括存储器单元，其被配置为存储关于位于晶片的多个骰子处的一组可疑缺陷的位置的信息; 电子光学器件，被配置为获得参考元件的图像，其中所述参考元件位于所述晶片的第一参考管芯内; 以及处理器，其被配置为：将可疑缺陷的第一子集与第一参考元素子集进行比较，以提供第一评估结果; 并且响应于所述第一评估结果选择参考元素的第二子集的源。 电子光学器件还被配置为当确定第二参考管芯是第二参考元件子集的源时，获得位于晶片的第二参考管芯内的参考元件的第二子集的图像 。 处理器还被配置为将可疑缺陷的第二子集与第二参考元素子集进行比较，以提供第二评估结果。

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