Invention Grant
- Patent Title: Substrate treatment apparatus and substrate treatment method
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Application No.: US15670349Application Date: 2017-08-07
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Publication No.: US10290491B2Publication Date: 2019-05-14
- Inventor: Shinsuke Kimura , Tatsuhiko Koide , Yoshihiro Ogawa
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt. L.L.P.
- Priority: JP2015-075015 20150401
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/306 ; H01L21/67
Abstract:
In one embodiment, a substrate treatment apparatus includes a housing configured to house a substrate. The apparatus further includes a chemical supplying module configured to supply one or more chemicals in a gas state to the substrate in the housing, the one or more chemicals including a first chemical that contains a silylation agent. The apparatus further includes a cooling module configured to cool the substrate in the housing while any of the one or more chemicals is supplied to the substrate in the housing.
Public/Granted literature
- US20170338102A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD Public/Granted day:2017-11-23
Information query
IPC分类:
