Invention Grant
- Patent Title: Semiconductor memory device
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Application No.: US15692381Application Date: 2017-08-31
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Publication No.: US10297295B2Publication Date: 2019-05-21
- Inventor: Hiroki Murakami , Makoto Senoo
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JP2016-170625 20160901
- Main IPC: G11C7/10
- IPC: G11C7/10 ; G11C7/22 ; G11C8/18 ; G11C11/4093 ; G11C16/04 ; G11C16/08 ; G11C16/10 ; G11C16/26 ; G11C16/32

Abstract:
A semiconductor memory device which is capable of high-speed operation in synchronization with external control signals is provided. The semiconductor memory device has a data input portion, a memory array, a data output portion, and a control portion. The data input portion receives command and address input data in response to the external control signals. The memory array has a plurality of memory elements. The data output portion outputs data read from the memory array in response to the external control signals. The control portion has the function of delay-compensation. During the time interval for receiving the input data, the function of delay-compensation estimates the delay time of the internal circuits, stores the estimated delay-time in a memory unit, and adjusts the output timing of the data output portion.
Public/Granted literature
- US20180061462A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2018-03-01
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