- 专利标题: Circuit board having conductive polymer
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申请号: US15716541申请日: 2017-09-27
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公开(公告)号: US10299367B2公开(公告)日: 2019-05-21
- 发明人: Ming-Jaan Ho , Hsiao-Ting Hsu
- 申请人: Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- 申请人地址: CN Shenzhen CN Qinhuangdao
- 专利权人: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- 当前专利权人: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- 当前专利权人地址: CN Shenzhen CN Qinhuangdao
- 代理机构: ScienBiziP, P.C.
- 优先权: CN201610325604 20160517
- 主分类号: H01B1/22
- IPC分类号: H01B1/22 ; H05K1/02 ; C08F112/32 ; C08K3/28 ; C09D5/24 ; C09D125/18 ; H05K1/09 ; H05K1/11 ; C08F12/22
摘要:
A circuit board includes a flexible board, a composite film, and a copper layer. The composite film is formed on the flexible board and defines at least one through hole. The composite film includes a base layer having an active surface, and a conductive layer formed by coated a conductive polymer on the active surface. The conductive polymer is made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization. The copper layer covers the conductive layer and an inner wall of each of the at least one through hole. The copper layer is electrically connected to the flexible substrate by the through hole.
公开/授权文献
- US20180070437A1 CIRCUIT BOARD HAVING CONDUCTIVE POLYMER 公开/授权日:2018-03-08
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