公开(公告)号：US10660218B2

公开(公告)日：2020-05-19

申请号：US15957875

申请日：2018-04-19

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Xian-Qin Hu ,  Li-Kun Liu ,  Yan-Lu Li ,  Ming-Jaan Ho

IPC分类号： H05K3/46 ,  H05K3/00 ,  H05K3/42 ,  H01L23/498 ,  H05K1/18 ,  H01L21/48 ,  H05K1/11 ,  H05K3/28 ,  H05K3/06

摘要： A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.

公开(公告)号：US10923411B2

公开(公告)日：2021-02-16

申请号：US16455971

申请日：2019-06-28

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  GARUDA TECHNOLOGY CO., LTD

发明人： Ning Hou ,  Cong Lei ,  Biao Li ,  Ming-Jaan Ho

IPC分类号： B21D39/00 ,  B29L31/18 ,  H01L23/373 ,  H01L21/48 ,  H01L23/427 ,  H05K7/20

摘要： A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks.

公开(公告)号：US10575406B1

公开(公告)日：2020-02-25

申请号：US16147485

申请日：2018-09-28

申请人： Avary Holding (Shenzhen) Co., Limited ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Fu-Yun Shen ,  Ming-Jaan Ho ,  Hsiao-Ting Hsu

IPC分类号： H05K3/02 ,  H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K3/00

摘要： A flexible circuit board includes a substrate including a base layer and a bonding layer formed on each of opposite sides of the base layer. Each of the two bonding layers is formed by coating a bonding solution and drying the bonding solution. The bonding solution is composed of an adhesive and a solvent. A viscosity of the adhesive is 5000 millipascal-seconds. The adhesive is composed of a precursor having a mass fraction of 35%-65%, carboxyl modified polyphenylene oxide having a mass fraction of 10%-15%, bisphenol-F-epoxy resin having a mass fraction of 10%-15%, a silane coupling agent having a mass fraction of 0%-1.5%, silica filler having a mass fraction of 5%-20%, and a flame retardant filler having a mass fraction of 10%-20%.

公开(公告)号：US10299367B2

公开(公告)日：2019-05-21

申请号：US15716541

申请日：2017-09-27

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

发明人： Ming-Jaan Ho ,  Hsiao-Ting Hsu

IPC分类号： H01B1/22 ,  H05K1/02 ,  C08F112/32 ,  C08K3/28 ,  C09D5/24 ,  C09D125/18 ,  H05K1/09 ,  H05K1/11 ,  C08F12/22

摘要： A circuit board includes a flexible board, a composite film, and a copper layer. The composite film is formed on the flexible board and defines at least one through hole. The composite film includes a base layer having an active surface, and a conductive layer formed by coated a conductive polymer on the active surface. The conductive polymer is made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization. The copper layer covers the conductive layer and an inner wall of each of the at least one through hole. The copper layer is electrically connected to the flexible substrate by the through hole.

公开(公告)号：US11778752B2

公开(公告)日：2023-10-03

申请号：US17418551

申请日：2020-01-21

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Hsiao-Ting Hsu ,  Ming-Jaan Ho ,  Fu-Yun Shen

IPC分类号： H05K1/02 ,  H05K3/30 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18

CPC分类号： H05K3/306 ,  H05K1/0353 ,  H05K1/092 ,  H05K1/185 ,  H05K2201/0141 ,  H05K2201/0145

摘要： A method for manufacturing a circuit board (100) includes: providing a first single-sided circuit substrate (20) including an insulating base layer (11) and a circuit layer (13); forming first conductive posts (111) electrically connected to the circuit layer (13) in the insulating base layer (11) to obtain a second single-sided circuit substrate (13); providing a first adhesive layer (40), forming second conductive posts (401); providing one second single-sided circuit substrate (30), defining a receiving groove (31) to obtain a third single-sided circuit substrate (50); providing another first single-sided circuit substrate (20), mounting an electronic component (14) on the circuit layer (13) to obtain a surface mounted circuit substrate (60); stacking the first single-sided circuit substrate (20), the first adhesive layer (40), the second single-sided circuit substrate (30), at least one of the third single-sided circuit substrate (50), and the surface mounted circuit substrate (60) in that order; pressing the intermediate body (70).

公开(公告)号：US10653015B2

公开(公告)日：2020-05-12

申请号：US16255236

申请日：2019-01-23

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Xian-Qin Hu ,  Li-Kun Liu ,  Yan-Lu Li ,  Ming-Jaan Ho

IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K1/18 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00 ,  H05K3/42 ,  H05K3/28 ,  H05K3/06

摘要： A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.

公开(公告)号：US10321561B2

公开(公告)日：2019-06-11

申请号：US15643121

申请日：2017-07-06

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.

发明人： Xian-Qin Hu ,  Ming-Jaan Ho

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K1/18 ,  H05K1/14 ,  H05K3/22 ,  H05K3/24 ,  H05K3/42

摘要： A flexible printed circuit board (PCB), a method for manufacturing the flexible PCB, and a PCB structure having the flexible PCB are disclosed. A flexible printed circuit board includes a first conductive pattern layer, a second conductive pattern layer, a plurality of first conductive pillars, and a plurality of second conductive pillars. Each of the plurality of first conductive pillars electrically connects to the first conductive pattern layer and is spaced from the second conductive pattern layer, and a plurality of second conductive pillars electrically connects to the second conductive pattern layer and is spaced from the first conductive pattern layer. The plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads.

公开(公告)号：US10117328B1

公开(公告)日：2018-10-30

申请号：US15690402

申请日：2017-08-30

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Fu-Wei Zhong ,  Ming-Jaan Ho ,  Yi-Qiang Zhuang ,  Xin Zhang

IPC分类号： H05K3/36 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09 ,  H05K3/40 ,  H05K3/42

摘要： The present disclosure relates to a flexible circuit board. The flexible circuit board includes a first conductive trace substrate and a third conductive layer, a second conductive post and a third conductive post. The first conductive trace substrate includes a first insulating layer, a first conductive layer and a second conductive layer formed two opposite surfaces of the first insulating layer. The first conductive layer includes a first signal line, the second conductive layer includes a second signal line, and the first signal line is parallel connected with the second signal line.

公开(公告)号：US11252818B2

公开(公告)日：2022-02-15

申请号：US16856218

申请日：2020-04-23

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Rui-Wu Liu ,  Ming-Jaan Ho ,  Lei Zhou ,  Man-Zhi Peng

IPC分类号： H05K1/14 ,  H05K1/02 ,  H05K3/36 ,  H05K3/24 ,  H05K3/06

摘要： A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

公开(公告)号：US10533811B2

公开(公告)日：2020-01-14

申请号：US15990767

申请日：2018-05-28

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.

发明人： Xian-Qin Hu ,  Fu-Yun Shen ,  Ming-Jaan Ho

IPC分类号： F28F21/08 ,  F28F3/04 ,  F28D15/02

摘要： A heat dissipation device includes etched or other grooves for adhesive surrounding etched or other recesses for heat-dissipating fluid, these being created in a first copper sheet and a second copper sheet brought together. The first copper sheet includes first recesses and the second copper sheet includes corresponding second recesses. The second copper sheet is adhesively fixed on the first copper sheet and an airtight receiving cavity is formed by the first and second recesses being brought together. The heat-dissipating fluid in the airtight receiving cavity carries away heat generated by a heat-producing device to which the heat-dissipating device is fixed.