Invention Grant
- Patent Title: Chip capacitor and method for manufacturing the same
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Application No.: US15836208Application Date: 2017-12-08
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Publication No.: US10304633B2Publication Date: 2019-05-28
- Inventor: Hiroyuki Okada , Yasuhiro Fuwa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2012-007071 20120117; JP2012-007072 20120117; JP2012-007073 20120117; JP2012-007074 20120117; JP2012-007075 20120117; JP2012-007076 20120117; JP2012-268570 20121207
- Main IPC: H01G5/011
- IPC: H01G5/011 ; H01G4/33 ; H01G4/40 ; H01G4/38 ; H01L49/02 ; H01G4/015 ; H01L27/01 ; H01G5/38

Abstract:
A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.
Public/Granted literature
- US20180174759A1 CHIP CAPACITOR AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-06-21
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