Invention Grant
- Patent Title: Alkoxysilane-modified polyamic acid solution, laminate and flexible device using same, and laminate manufacturing method
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Application No.: US15502706Application Date: 2015-07-15
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Publication No.: US10308767B2Publication Date: 2019-06-04
- Inventor: Takahiro Akinaga , Yuki Takiguchi , Shinji Ozawa
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka-shi
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-164456 20140812
- International Application: PCT/JP2015/070250 WO 20150715
- International Announcement: WO2016/024457 WO 20160218
- Main IPC: C08G73/10
- IPC: C08G73/10 ; B32B27/34 ; B32B27/28 ; H05K1/03 ; H05K3/00 ; C09D179/08

Abstract:
Provided are a polyamic acid solution that can be formed into a film without peeling even when the film is thick and can be stably stored at room temperature, and a laminate that can be suitably used for production of a flexible device. In the alkoxysilane-modified polyamic acid solution according to the present invention, an additive amount of an alkoxysilane compound that contains an amino group is more than 0.050 parts by weight and less than 0.100 parts by weight.
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