Invention Grant
- Patent Title: Solid-state image sensor, imaging device, and electronic device
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Application No.: US15945539Application Date: 2018-04-04
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Publication No.: US10313618B2Publication Date: 2019-06-04
- Inventor: Takashi Machida , Kazuyoshi Yamashita
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2014-256046 20141218
- Main IPC: H04N5/232
- IPC: H04N5/232 ; H04N5/369 ; H04N5/374 ; H01L27/14 ; H01L27/146 ; H04N5/355 ; G01S7/486 ; G01S17/89 ; H01L23/522 ; H04N5/378 ; G01S17/93

Abstract:
The present technology relates to a solid-state image sensor, an imaging device, and an electronic device capable of switching FD conversion efficiency in all pixels of a solid-state image sensor. A photodiode performs photoelectric conversion on incident light. A floating diffusion (FD) stores charge obtained by the photodiode. FD2, which is a second FD to which the capacity of an additional capacitor MIM is added, adds the capacity to the FD. The additional capacitor MIM is constituted by a first electrode formed by a wiring layer and a second electrode formed by a metallic light blocking film provided on a surface of a substrate on which the photodiode is formed. Switching between the FD and FD+FD2 allows switching of the FD conversion efficiency. The present technology is applicable to a CMOS image sensor.
Public/Granted literature
- US20180234651A1 SOLID-STATE IMAGE SENSOR, IMAGING DEVICE, AND ELECTRONIC DEVICE Public/Granted day:2018-08-16
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