Invention Grant
- Patent Title: Low dielectric constant and solventless resin composition and substrate structure
-
Application No.: US14974547Application Date: 2015-12-18
-
Publication No.: US10316182B2Publication Date: 2019-06-11
- Inventor: Jyh-Long Jeng , Jeng-Yu Tsai , Wei-Ta Yang
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW104142225A 20151216
- Main IPC: C08L63/10
- IPC: C08L63/10 ; C08G59/14 ; C08K3/36 ; C08K5/1515 ; H01B3/40
Abstract:
A solventless resin composition with a low dielectric constant and a substrate structure are provided. The composition includes: (a) 20-50 parts by weight of a copolymer having the structure of Formula (I) wherein, i, j, k, l, and m are independently an integer from 1 to 10; (b) 50-80 parts by weight of a compound having the structure of Formula (II) (c) 80-100 parts by weight of a hardener; and (d) 70-100 parts by weight of an inorganic filler.
Public/Granted literature
- US20170174880A1 LOW DIELECTRIC CONSTANT AND SOLVENTLESS RESIN COMPOSITION AND SUBSTRATE STRUCTURE Public/Granted day:2017-06-22
Information query
