公开(公告)号：US11746083B2

公开(公告)日：2023-09-05

申请号：US17138254

申请日：2020-12-30

Applicant: Industrial Technology Research Institute

Inventor： Jyh-Long Jeng ,  Jeng-Yu Tsai ,  Wei-Ta Yang

IPC: C08G18/78 ,  C07C271/58 ,  C08G18/34

CPC classification number: C07C271/58 ,  C08G18/34 ,  C08G18/7812

Abstract: A compound, a resin composition and a laminated substrate thereof are provided. The compound has a structure represented by Formula (I)




wherein A1 is C24-48 alkylene group, C24-48 alkenylene group, C24-48 alkynylene group, C24-48 alicyclic alkylene group, C24-48 alicyclic alkenylene group, or C24-48 alicyclic alkynylene group. A2 is C2-12 alkylene group, C6-C25 arylene group with two reactive groups, C4-8 cycloalkylene group, C5-25 heteroarylene group, divalent C7-C25 alkylaryl group, divalent C7-25 acylaryl group, divalent C6-25 aryl ether group, or divalent C7-25 acyloxyaryl group; and, n≥1.

公开(公告)号：US10179833B2

公开(公告)日：2019-01-15

申请号：US15395599

申请日：2016-12-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ming-Tsung Hong ,  Yun-Ching Lee ,  Wei-Ta Yang ,  Meng-Song Yin

IPC: C03C25/30 ,  C03C25/32 ,  C08G61/08 ,  C08G61/12 ,  C08L25/10 ,  C08L65/00 ,  C08L45/00 ,  C08L47/00 ,  H05K1/03 ,  C08J5/24 ,  C08F36/20 ,  C08F32/08 ,  C08F232/08 ,  C08G61/02 ,  C09D171/12 ,  H05K1/09 ,  C08J5/04 ,  C09D125/10 ,  H05K1/02

Abstract: An oligomer, composition, and composite material employing the same are provided. The oligomer can be a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a reaction product of a reactant (c) and a reactant (d). The reactant (b) can be or a combination thereof, wherein a is 0 or 1, and R1 is independently hydrogen or and wherein b is 0-6; c is 0 or 1; and, d is 0-6. The reactant (c) is wherein R2 is C5-10 alkyl group. The reactant (d) is wherein e is 0-10.

公开(公告)号：US09236169B2

公开(公告)日：2016-01-12

申请号：US13891017

申请日：2013-05-09

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ming-Tsung Hong ,  Yun-Ching Lee ,  Li-Chun Liang ,  Wei-Ta Yang

IPC: H01B13/30 ,  H05K1/02 ,  H05K1/03 ,  H05K3/28

CPC classification number: H01B13/30 ,  H05K1/0218 ,  H05K1/0393 ,  H05K3/281 ,  Y10T428/249958 ,  Y10T428/249982 ,  Y10T428/249985

Abstract: Provided is an electromagnetic wave shielding structure, including: a substrate; and a porous composite film formed on the substrate, wherein the porous composite film includes a continuous phase network fused from a plurality of metal nanoparticles, a first resin composition coated on a surface of the continuous phase network and a plurality of holes which are void spaces in the continuous phase network coated with the first resin composition.

Abstract translation: 提供一种电磁波屏蔽结构，包括：基板; 以及形成在所述基板上的多孔复合膜，其中所述多孔复合膜包括从多个金属纳米粒子熔合的连续相网络，涂覆在所述连续相网的表面上的第一树脂组合物和作为空隙空间的多个孔 在连续相网中涂覆有第一种树脂组合物。

公开(公告)号：US09012572B2

公开(公告)日：2015-04-21

申请号：US14141005

申请日：2013-12-26

Applicant: Industrial Technology Research Institute

Inventor： I-Hong Lin ,  Chung-Cheng Lin ,  Wei-Ta Yang ,  Chih-Hsiang Lin

IPC: C08F283/08 ,  C08G65/48 ,  C08G65/44 ,  C08G63/78

CPC classification number: C08G65/485 ,  C08G65/44

Abstract: A polyphenylene ether oligomer is provided. The polyphenylene ether oligomer has the following formula (I): X is  R is H or C1-6 alkyl group; Y independently is a moiety polymerized by at least two different phenol-based compounds; and Z independently is H, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group.

Abstract translation: 提供聚苯醚低聚物。 聚苯醚低聚物具有下式（I）：X是R是H或C 1-6烷基; Y独立地是由至少两种不同的酚基化合物聚合的部分; Z独立为H，丙烯酰基，烯丙基，乙烯基苄基，环氧丙基，甲基丙烯酰基，炔丙基或氰基烯丙基。

公开(公告)号：US20240359433A1

公开(公告)日：2024-10-31

申请号：US18645952

申请日：2024-04-25

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Wen-Chin Lee ,  Meng-Song Yin ,  Man-Chun Yu ,  Wei-Ta Yang

IPC: B32B15/092

CPC classification number: B32B15/092 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/08

Abstract: A composition, composite material, and copper clad laminate are provided. The composition includes 100 parts by weight of a compound having two epoxy groups, 20-80 parts by weight of a compound having at least two phenolic hydroxy groups, and 0.01-1.5 parts by weight of an ionic liquid. The ionic liquid is not imidazolium ionic liquid.

公开(公告)号：US11932714B2

公开(公告)日：2024-03-19

申请号：US17871363

申请日：2022-07-22

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Yi Chu ,  Yun-Ching Lee ,  Li-Chun Liang ,  Wei-Ta Yang ,  Hsiang-Chin Juan

IPC: C08F232/08 ,  C08F232/04 ,  C08F236/14

CPC classification number: C08F232/08 ,  C08F232/04 ,  C08F236/14 ,  C08F2800/10 ,  C08F2810/20

Abstract: A copolymer, a film composition and a composite material employing the same are provided. The copolymer is a copolymerization product of a composition, wherein the composition includes a monomer (a), a monomer (b) and a monomer (c). The monomer (a) is a compound having a structure represented by Formula (I), the monomer (b) is a compound having a structure represented by Formula (II), and the monomer (c) is a compound having a structure represented by Formula (III)




wherein R1, R2, R3, R4, R5 and R6 are as defined in specification.

公开(公告)号：US11059938B2

公开(公告)日：2021-07-13

申请号：US16593320

申请日：2019-10-04

Applicant: Industrial Technology Research Institute

Inventor： Yen-Yi Chu ,  Hsi-Yi Chin ,  Wei-Ta Yang ,  Chi-En Kuan

IPC: C08G61/02 ,  C08L65/00

Abstract: The disclosure provides a film composition, wherein the film composition includes an oligomer and a crosslinking agent. The oligomer can have a structure represented by Formula (I) wherein R1 and R2 are independently hydrogen, C1-20 alkyl group, C2-20 alkenyl group, C6-12 aryl group, C6-12 alkylaryl group, C5-12 cycloalkyl group, C6-20 cycloalkylalkyl group, alkoxycarbonyl group, or alkylcarbonyloxy group; R1 is not hydrogen when R2 is hydrogen; a is 0 or 1; 100≥n≥1; 100≥m≥1; and when n is not 0, the ratio of n to m is from 3:1 to 1:4. The weight ratio of the oligomer and the crosslinking agent can be from 9:1 to 3:7. The oligomer has a number average molecular weight (Mn) from 1,000 to 8,000.

公开(公告)号：US10316182B2

公开(公告)日：2019-06-11

申请号：US14974547

申请日：2015-12-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long Jeng ,  Jeng-Yu Tsai ,  Wei-Ta Yang

IPC: C08L63/10 ,  C08G59/14 ,  C08K3/36 ,  C08K5/1515 ,  H01B3/40

Abstract: A solventless resin composition with a low dielectric constant and a substrate structure are provided. The composition includes: (a) 20-50 parts by weight of a copolymer having the structure of Formula (I) wherein, i, j, k, l, and m are independently an integer from 1 to 10; (b) 50-80 parts by weight of a compound having the structure of Formula (II) (c) 80-100 parts by weight of a hardener; and (d) 70-100 parts by weight of an inorganic filler.

公开(公告)号：US09642249B2

公开(公告)日：2017-05-02

申请号：US14266405

申请日：2014-04-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Wei-Ta Yang ,  Li-Chun Liang ,  I-Hong Lin ,  Chung-Cheng Lin

IPC: H05K1/03 ,  B29B7/90 ,  B29K69/00

CPC classification number: H05K1/0366 ,  B29B7/90 ,  B29K2069/00 ,  H05K1/0326 ,  H05K2201/0209 ,  Y10T428/31681 ,  Y10T428/31725

Abstract: A disclosure provides a resin composition, a prepreg, and a substrate employing the same. According to an embodiment of the disclosure, the resin composition includes a polyphenylene ether compound, and a bismaleimide. The prepreg includes a cured product of the resin composition. The substrate includes a product fabricated by the resin composition or the prepreg.

公开(公告)号：US11118082B2

公开(公告)日：2021-09-14

申请号：US16232766

申请日：2018-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long Jeng ,  Jeng-Yu Tsai ,  Yen-Yi Chu ,  Wei-Ta Yang

IPC: C09D145/00 ,  C09D4/06 ,  H01B3/44 ,  C08F299/00

Abstract: A composition, an insulating material, and a method for preparing an insulating material are provided. The composition includes (a) 100 parts by weight of oligomer of Formula (I) (b) 20-50 parts by weight of polymer having at least two reactive functional groups, wherein the reactive functional group is a reactive-double-bond-containing functional group; (c) 1-5 parts by weight of photoinitiator; (d) 0.5-2 parts by weight of thermal initiator; and (e) 0.5-2 parts by weight of photoacid generator.