- 专利标题: Semiconductor packages
-
申请号: US15860730申请日: 2018-01-03
-
公开(公告)号: US10319702B2公开(公告)日: 2019-06-11
- 发明人: Chul Park , Seonggwan Lee , Minkyeong Park
- 申请人: Chul Park , Seonggwan Lee , Minkyeong Park
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel, P.A.
- 优先权: KR10-2017-0101284 20170809
- 主分类号: H01L25/04
- IPC分类号: H01L25/04 ; H01L25/07 ; H01L25/11 ; H01L25/075 ; H01L25/065
摘要:
A semiconductor package includes a substrate including a signal pattern on an upper surface thereof, a chip stack on the substrate, and a first semiconductor chip and one or more spacers between the substrate and the chip stack. The chip stack includes one or more second semiconductor chips stacked on the substrate. The one or more spacers and the first semiconductor chip are adjacent to respective corners of a lowermost second semiconductor chip, in plan view. The one or more spacers have the same planar shape as the first semiconductor chip.
公开/授权文献
- US20190051634A1 SEMICONDUCTOR PACKAGES 公开/授权日:2019-02-14