An electronic component is able to be mounted on a mounting substrate including a pair of first edge portions that faces each other, and a pair of second edge portions that is perpendicular or substantially perpendicular to the pair of first edge portions and faces each other. The mounting substrate has a structure that allows at least any one of the electronic component, a first electronic component, and a second electronic component, to be mounted thereon. When a dimension of the first electronic component in a length direction is designated as L1, a dimension of the first electronic component in a width direction is designated as W1, a dimension of the second electronic component in the length direction is designated as L2, and a dimension of the second electronic component in the width direction is designated as W2, a dimension of the electronic component in the width direction is any one of W1 and W2. A dimension of the electronic component in the length direction is L2 when the dimension of the electronic component in the width direction is W1, and is L1 when the dimension of the electronic component in the width direction is W2.