Invention Grant
- Patent Title: Bonding systems
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Application No.: US15644292Application Date: 2017-07-07
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Publication No.: US10340248B2Publication Date: 2019-07-02
- Inventor: Masataka Matsunaga , Takashi Koga , Takeshi Tamura , Takahiro Masunaga , Yuji Mimura , Masaru Honda , Toshifumi Inamasu , Satoshi Nishimura
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2016-137632 20160712
- Main IPC: H01L21/18
- IPC: H01L21/18 ; H01L21/67 ; H01L23/00 ; H05K13/00 ; H01L21/677
Abstract:
A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.
Public/Granted literature
- US20180019225A1 Bonding System Public/Granted day:2018-01-18
Information query
IPC分类:
