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    Bonding systems
    1.
    发明授权
    Bonding systems 有权

    公开(公告)号：US10340248B2

    公开(公告)日：2019-07-02

    申请号：US15644292

    申请日：2017-07-07

    Applicant: TOKYO ELECTRON LIMITED

    Inventor： Masataka Matsunaga ,  Takashi Koga ,  Takeshi Tamura ,  Takahiro Masunaga ,  Yuji Mimura ,  Masaru Honda ,  Toshifumi Inamasu ,  Satoshi Nishimura

    IPC: H01L21/18 ,  H01L21/67 ,  H01L23/00 ,  H05K13/00 ,  H01L21/677

    Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

    BONDING SYSTEM
    3.
    发明申请
    BONDING SYSTEM 有权
    粘接系统

    公开(公告)号：US20150059985A1

    公开(公告)日：2015-03-05

    申请号：US14457219

    申请日：2014-08-12

    Applicant: Tokyo Electron Limited

    Inventor： Masataka Matsunaga ,  Naoto Yoshitaka ,  Satoshi Nishimura

    IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/677

    CPC classification number: H01L21/67173 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/68 ,  H01L24/75 ,  H01L2224/7515 ,  H01L2224/753 ,  H01L2224/7565 ,  H01L2224/75981 ,  H01L2924/06 ,  H01L2924/15788 ,  H01L2924/20106 ,  H01L2924/00

    Abstract: An object of the present disclosure is to reduce a footprint. A bonding system of the present disclosure includes a first processing station, a second processing station, and a carry-in/out station. The first processing station includes a first conveyance region, a coating device, a heating device, and a first delivery block. The second processing station includes a plurality of bonding devices, a second conveyance region, and a second delivery block. Each of the plurality of bonding devices bonds the first substrate to the second substrate. The second conveyance region is a region configured to convey the first substrate and the second substrate to and from the plurality of bonding devices. The second delivery block delivers the first substrate, the second substrate and the superimposed substrate between the first conveyance region and the second conveyance region.

    Abstract translation: 本公开的目的是减少占用空间。 本公开的接合系统包括第一处理站，第二处理站和进/出站。 第一处理站包括第一输送区域，涂布装置，加热装置和第一输送块。 第二处理站包括多个接合装置，第二输送区域和第二输送块。 多个接合装置中的每一个将第一基板结合到第二基板。 第二输送区域是构造成将第一基板和第二基板输送到多个接合装置的区域。 第二输送块在第一输送区域和第二输送区域之间输送第一基板，第二基板和叠加基板。

    BONDING SYSTEM
    4.
    发明公开
    BONDING SYSTEM 审中-公开

    公开(公告)号：US20230207331A1

    公开(公告)日：2023-06-29

    申请号：US17995931

    申请日：2021-03-30

    Applicant: Tokyo Electron Limited

    Inventor： Takuo Kawauchi ,  Masataka Matsunaga ,  Ryoichi Sakamoto ,  Masaru Honda ,  Satoshi Nishimura

    IPC: H01L21/447 ,  H01L21/67 ,  H01L21/677 ,  H01L21/02

    CPC classification number: H01L21/447 ,  H01L21/67201 ,  H01L21/6773 ,  H01L21/67739 ,  H01L21/02002

    Abstract: A first transfer device and a second transfer device are configured to transfer a first substrate and a second substrate in a normal pressure atmosphere. A third transfer device is configured to transfer the first substrate and the second substrate in a decompressed atmosphere. A load lock chamber has accommodation sections allowed to accommodate therein the first substrate and the second substrate, and is allowed to switch an inside of the accommodation sections between the normal pressure atmosphere and the decompressed atmosphere. Multiple gates are respectively disposed on three different sides of the load lock chamber, and allowed to open or close the load lock chamber. The first transfer device, the second transfer device, and the third transfer device carry the first substrate and the second substrate into/out of the load lock chamber through different gates among the multiple gates.

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