- 专利标题: Ceramic substrate, layered body, and saw device
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申请号: US15317563申请日: 2016-04-26
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公开(公告)号: US10340886B2公开(公告)日: 2019-07-02
- 发明人: Keiichiro Geshi , Shigeru Nakayama
- 申请人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 申请人地址: JP Osaka-shi, Osaka
- 专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka-shi, Osaka
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JP2016-057300 20160322
- 国际申请: PCT/JP2016/062959 WO 20160426
- 国际公布: WO2016/159393 WO 20161006
- 主分类号: H03H9/25
- IPC分类号: H03H9/25 ; C04B35/111 ; B32B9/00 ; H03H9/02 ; H03H9/05 ; H03H9/08 ; H03H3/08 ; B32B18/00 ; C04B35/053 ; C04B35/057 ; C04B35/14 ; C04B35/185 ; C04B35/195 ; C04B35/443 ; C04B35/46 ; C04B35/495 ; C04B35/565 ; C04B35/581 ; C04B35/587
摘要:
A ceramic substrate is formed of a polycrystalline ceramic and has a supporting main surface. The supporting main surface has a roughness of 0.01 nm or more and 3.0 nm or less in terms of Sa. The number of projections and depressions with a height of 1 nm or more in a square region with 50 μm sides on the supporting main surface is less than 5 on average, and the number of projections and depressions with a height of 2 nm or more in the square region is less than 1 on average.
公开/授权文献
- US20170279435A1 CERAMIC SUBSTRATE, LAYERED BODY, AND SAW DEVICE 公开/授权日:2017-09-28
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