- 专利标题: Resistor element and resistor element assembly
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申请号: US15652927申请日: 2017-07-18
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公开(公告)号: US10347404B2公开(公告)日: 2019-07-09
- 发明人: Kwang Hyun Park , Jang Seok Yun , Kyung Seon Baek
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si, Gyeonggi-Do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-Do
- 代理机构: Morgan Lewis & Bockius LLP
- 优先权: KR10-2016-0143439 20161031
- 主分类号: H01C7/18
- IPC分类号: H01C7/18 ; H01C1/148 ; H01C1/01 ; H05K1/18 ; H01C17/065 ; H01C17/24 ; H05K3/34
摘要:
A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.
公开/授权文献
- US20180122539A1 RESISTOR ELEMENT AND RESISTOR ELEMENT ASSEMBLY 公开/授权日:2018-05-03
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