-
公开(公告)号：US11094436B2
公开(公告)日：2021-08-17
申请号：US16889982
申请日：2020-06-02
发明人： Ji Sook Yoon , Kwang Hyun Park
IPC分类号： H01C1/14 , H01C17/065 , H01C7/00
摘要： A resistor component includes an insulating substrate; a resistance layer disposed on one surface of the insulating substrate; and first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer, wherein each the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer.
-
公开(公告)号：US09953749B2
公开(公告)日：2018-04-24
申请号：US15464649
申请日：2017-03-21
发明人： Kwang Hyun Park , Hae In Kim
摘要： A resistor element includes a base substrate having first and second surfaces opposing each other; a resistor layer disposed on the first surface of the base substrate; first and second terminals disposed on opposing end portions of the base substrate, respectively, and electrically connected to opposing sides of the resistor layer, respectively; a third terminal disposed between the first terminal and the second terminal on the second surface of the base substrate and spaced apart from the first terminal and the second terminal; and electrostatic discharge (ESD)-preventing members connecting the first terminal and the third terminal to each other and connecting the second terminal and the third terminal to each other.
-
公开(公告)号：US20220270790A1
公开(公告)日：2022-08-25
申请号：US17545270
申请日：2021-12-08
发明人： Ah Ra Cho , Kwang Hyun Park
摘要： A chip resistor component, includes: a substrate having one surface, and one side surface and the other side surface facing each other in one direction; an terminal including an internal electrode disposed on the one surface, and an external electrode disposed on the one side surface to be connected to the internal electrode; a resistive layer disposed on the one surface, and including an outermost pattern connected to the internal electrode; and a protective layer disposed on the one surface to cover the resistive layer. The outermost pattern of the resistive layer has a first region in contact with the internal electrode and a second region extending, in the one direction, from the first region towards the other side surface. A ratio of a length of the second region in the one direction to a length of the chip resistor component in the one direction is 0.02 or more.
-
公开(公告)号：US20210183544A1
公开(公告)日：2021-06-17
申请号：US16908391
申请日：2020-06-22
发明人： Ah Ra Cho , Ji Sook Yoon , Kwang Hyun Park
IPC分类号： H01C1/148 , H01C1/01 , H01C17/065 , H01C7/00
摘要： A resistor component includes an insulating substrate, a resistor layer disposed on one surface of the insulating substrate and having one end and the other end opposing each other in a first direction, and first and second terminals disposed on the insulating substrate and spaced apart from each other to oppose each other in a second direction perpendicular to the first direction, and connected to the resistor layer. A slit in the resistor layer extends in the first direction, and a ratio of a length of the slit in the first direction to a length of the resistor layer in the first direction is greater than 0.7 and equal to or lower than 0.9.
-
公开(公告)号：US11139091B2
公开(公告)日：2021-10-05
申请号：US16908391
申请日：2020-06-22
发明人： Ah Ra Cho , Ji Sook Yoon , Kwang Hyun Park
IPC分类号： H01C1/148 , H01C7/00 , H01C17/065 , H01C1/01
摘要： A resistor component includes an insulating substrate, a resistor layer disposed on one surface of the insulating substrate and having one end and the other end opposing each other in a first direction, and first and second terminals disposed on the insulating substrate and spaced apart from each other to oppose each other in a second direction perpendicular to the first direction, and connected to the resistor layer. A slit in the resistor layer extends in the first direction, and a ratio of a length of the slit in the first direction to a length of the resistor layer in the first direction is greater than 0.7 and equal to or lower than 0.9.
-
公开(公告)号：US20190259514A1
公开(公告)日：2019-08-22
申请号：US16400335
申请日：2019-05-01
发明人： Kwang Hyun Park , Jang Seok Yun , Kyung Seon Baek
摘要： A resistor element includes a base substrate having first and second surfaces opposing each other and first and second end surfaces opposing each other and connecting the first and second surfaces. A first resistor layer is on the first surface of the base substrate. First and second terminals are respectively on the first and second end surfaces. A second resistor layer is on the first resistor layer, is connected to the first and second terminals, and includes a copper-manganese-tin (Cu—Mn—Sn)-based composition.
-
公开(公告)号：US11830641B2
公开(公告)日：2023-11-28
申请号：US17545270
申请日：2021-12-08
发明人： Ah Ra Cho , Kwang Hyun Park
摘要： A chip resistor component, includes: a substrate having one surface, and one side surface and the other side surface facing each other in one direction; an terminal including an internal electrode disposed on the one surface, and an external electrode disposed on the one side surface to be connected to the internal electrode; a resistive layer disposed on the one surface, and including an outermost pattern connected to the internal electrode; and a protective layer disposed on the one surface to cover the resistive layer. The outermost pattern of the resistive layer has a first region in contact with the internal electrode and a second region extending, in the one direction, from the first region towards the other side surface. A ratio of a length of the second region in the one direction to a length of the chip resistor component in the one direction is 0.02 or more.
-
公开(公告)号：US11315708B1
公开(公告)日：2022-04-26
申请号：US17182681
申请日：2021-02-23
发明人： Kwang Hyun Park , Ah Ra Cho
摘要： A chip resistor includes: an insulating substrate; a resistor portion disposed on one surface of the insulating substrate and including a plurality of resistor bodies spaced apart from each other and a plurality of internal electrodes connecting the plurality of resistor bodies to each other; and a first external electrode and a second external electrode disposed on the one surface of the insulating substrate to be spaced apart from each other and respectively connected to the resistor portion, wherein each of the plurality of resistor bodies has a first end adjacent to the first external electrode and a second end opposing the first end and adjacent to the second external electrode, and each of the first end and the second end of each of the plurality of resistor bodies is connected to one of the plurality of internal electrodes, the first external electrode, or the second external electrode.
-
公开(公告)号：US20210202137A1
公开(公告)日：2021-07-01
申请号：US16889982
申请日：2020-06-02
发明人： Ji Sook Yoon , Kwang Hyun Park
IPC分类号： H01C1/14 , H01C7/00 , H01C17/065
摘要： A resistor component includes an insulating substrate; a resistance layer disposed on one surface of the insulating substrate; and first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer, wherein each the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer.
-
公开(公告)号：US10964461B1
公开(公告)日：2021-03-30
申请号：US16902764
申请日：2020-06-16
发明人： Yeon Hee Shin , Ji Sook Yoon , Kwang Hyun Park
摘要： A resistor element includes a base substrate having a first surface and a second surface, a resistive layer having a first surface disposed on the second surface of the base substrate, a second surface opposing the first surface of the resistive layer, and first to fourth sides connecting the first surface of the resistive layer to the second surface of the resistive layer, and internal electrodes spaced apart from each other on the second surface of the base substrate. The first and second sides of the resistive layer face each other in a direction in which the internal electrodes are spaced apart, and the third and fourth sides of the resistive layer connect the first and second sides. With the second surface of the base substrate, an angle between each of the third and fourth sides is greater than an angle between each of the first and second sides.
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.018 秒)
