Invention Grant
- Patent Title: Light-emitting device, integrated light-emitting device, and light-emitting module
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Application No.: US16039197Application Date: 2018-07-18
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Publication No.: US10355181B2Publication Date: 2019-07-16
- Inventor: Motokazu Yamada
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2017-141924 20170721; JP2017-195352 20171005
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/54 ; H01L33/50 ; H01L33/10 ; H01L25/075 ; F21V8/00

Abstract:
A light-emitting device includes: a base member having a conductive pattern; a light-emitting element arranged on the base member so as to be electrically connected to the conductive pattern; and a dielectric multi-layer film located on an upper surface of the light-emitting element. The dielectric multi-layer film has a first spectral reflectivity in an emission peak wavelength region of the light-emitting element and a second spectral reflectivity in a region that is located at a longer wavelength side of the emission peak wavelength region by 50 nm, and the second spectral reflectivity is greater by 10% or more than the first spectral reflectivity.
Public/Granted literature
- US20190027659A1 LIGHT-EMITTING DEVICE, INTEGRATED LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING MODULE Public/Granted day:2019-01-24
Information query
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