A liquid-encapsulation heat dissipation member is prepared by encapsulating a thermally conductive fluid in a closed container nd dissipates heat transferred from an electronic device in contact with the closed container, wherein the closed container includes an elastic portion composed of a thin elastomer serving as a surface to come into contact with the electronic device and following the shape of the electronic device and a heat dissipation portion composed of a hard material for dissipating heat, and the thermally conductive fluid contains a thermally conductive powder and has a viscosity of 200,000 mPa·s to 3,000,000 mPa·s.