-
公开(公告)号：US20160278237A1
公开(公告)日：2016-09-22
申请号：US15032357
申请日：2014-09-19
Applicant: POLYMATECH JAPAN CO., LTD.
Inventor： Yusuke Hattori , Jun Ishizawa
CPC classification number: H05K7/20263 , F28D15/00 , F28F3/02 , F28F3/12 , F28F9/001 , F28F21/06 , F28F21/067 , F28F23/00 , F28F2230/00 , F28F2255/02 , G06F1/203
Abstract: A liquid-encapsulation heat dissipation member is prepared by encapsulating a thermally conductive fluid in a closed container nd dissipates heat transferred from an electronic device in contact with the closed container, wherein the closed container includes an elastic portion composed of a thin elastomer serving as a surface to come into contact with the electronic device and following the shape of the electronic device and a heat dissipation portion composed of a hard material for dissipating heat, and the thermally conductive fluid contains a thermally conductive powder and has a viscosity of 200,000 mPa·s to 3,000,000 mPa·s.
Abstract translation: 通过将密封容器中的导热流体包封，并且散发从与密封容器接触的电子设备传递的热量来制备液体封装散热构件，其中，密封容器包括由用作 表面与电子设备接触并且遵循电子设备的形状以及由用于散热的硬质材料组成的散热部分，并且导热流体包含导热粉末，并且具有20万mPa·s的粘度 至300万mPa·s。
-
公开(公告)号：US10356944B2
公开(公告)日：2019-07-16
申请号：US15032357
申请日：2014-09-19
Applicant: POLYMATECH JAPAN CO., LTD.
Inventor： Yusuke Hattori , Jun Ishizawa
Abstract: A liquid-encapsulation heat dissipation member is prepared by encapsulating a thermally conductive fluid in a closed container nd dissipates heat transferred from an electronic device in contact with the closed container, wherein the closed container includes an elastic portion composed of a thin elastomer serving as a surface to come into contact with the electronic device and following the shape of the electronic device and a heat dissipation portion composed of a hard material for dissipating heat, and the thermally conductive fluid contains a thermally conductive powder and has a viscosity of 200,000 mPa·s to 3,000,000 mPa·s.
-
Search Results
2
records
(took 0.012 seconds)
