Invention Grant
- Patent Title: Metal cap assembly for optical communications
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Application No.: US15380247Application Date: 2016-12-15
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Publication No.: US10357841B2Publication Date: 2019-07-23
- Inventor: Ramesh Kothandapani , Chee Kong Lee
- Applicant: Materion Corporation
- Applicant Address: US OH Mayfield Heights
- Assignee: MATERION CORPORATION
- Current Assignee: MATERION CORPORATION
- Current Assignee Address: US OH Mayfield Heights
- Agency: Fay Sharpe LLP
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K1/00 ; B23K35/02 ; H05K5/00 ; H05K5/03 ; H05K5/04 ; H01L23/04 ; H01S5/022 ; B23K35/30 ; C22C5/02 ; H05K5/06 ; B23K101/40 ; B32B38/08 ; H01L21/50

Abstract:
A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the glass panel covering the opening there-through and attached to the assembly via a solder pre-form.
Public/Granted literature
- US20170095870A1 METAL CAP ASSEMBLY FOR OPTICAL COMMUNICATIONS Public/Granted day:2017-04-06
Information query
IPC分类: