Invention Grant
- Patent Title: Integrated circuit structure with guard ring
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Application No.: US15918623Application Date: 2018-03-12
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Publication No.: US10366916B2Publication Date: 2019-07-30
- Inventor: Chihy-Yuan Cheng , Chun-Chang Wu , Shun-Shing Yang , Ching-Sen Kuo , Feng-Jia Shiu , Chun-Chang Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L29/06 ; H01L21/765 ; H01L27/088 ; H01L21/8234
Abstract:
A semiconductor structure includes a substrate having a first region and a second region being adjacent each other; a first patterned layer formed on the substrate, wherein the first patterned layer includes first features in the first region, wherein the second region is free of the patterned layer; and a first guard ring disposed in the second region and surrounding the first features, wherein the first guard ring includes a first width W1 and is spaced a first distance D1 from the first features, W1 being greater than D1.
Public/Granted literature
- US20180204758A1 Integrated Circuit Structure with Guard Ring Public/Granted day:2018-07-19
Information query
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