Invention Grant
- Patent Title: Package and light-emitting device
-
Application No.: US15833644Application Date: 2017-12-06
-
Publication No.: US10367121B2Publication Date: 2019-07-30
- Inventor: Tadaaki Ikeda , Masaki Hayashi , Koji Abe , Kimihiro Miyamoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2015-192683 20150930; JP2016-112963 20160606
- Main IPC: H01L33/46
- IPC: H01L33/46 ; H01L33/48 ; H01L33/62 ; H01L33/60 ; H01L33/44

Abstract:
A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a bottom surface of the recess, a first resin body forming a lateral wall of the recess, and a second resin body arranged between the pair of leads; forming a reflective film entirely on at least the bottom surface of the recess and an inner surface of the lateral wall of the recess; and removing the reflective film formed on the pair of leads in the recess in the resin compact on which the reflective film has been formed.
Public/Granted literature
- US20180097150A1 PACKAGE AND LIGHT-EMITTING DEVICE Public/Granted day:2018-04-05
Information query
IPC分类: