Invention Grant
- Patent Title: Package structure and the method to fabricate thereof
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Application No.: US15334308Application Date: 2016-10-26
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Publication No.: US10373894B2Publication Date: 2019-08-06
- Inventor: Bau-Ru Lu , Jeng-Jen Li , Kun-Hong Shih , Kaipeng Chiang
- Applicant: CYNTEC CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC CO., LTD
- Current Assignee: CYNTEC CO., LTD
- Current Assignee Address: TW Hsinchu
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01L23/495 ; H01L21/56 ; H05K1/02 ; H05K1/18 ; H01L23/13 ; H01L23/498 ; H01L23/00

Abstract:
The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.
Public/Granted literature
- US20170047273A1 PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF Public/Granted day:2017-02-16
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