公开(公告)号：US10373894B2

公开(公告)日：2019-08-06

申请号：US15334308

申请日：2016-10-26

申请人： CYNTEC CO., LTD.

发明人： Bau-Ru Lu ,  Jeng-Jen Li ,  Kun-Hong Shih ,  Kaipeng Chiang

IPC分类号： H05K1/00 ,  H01L23/495 ,  H01L21/56 ,  H05K1/02 ,  H05K1/18 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00

摘要： The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

公开(公告)号：US20130328181A1

公开(公告)日：2013-12-12

申请号：US13969604

申请日：2013-08-18

申请人： CYNTEC CO., LTD.

发明人： Han-Hsiang Lee ,  Jeng-Jen Li ,  Kun-Hong Shih

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K7/1432 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/1327

摘要： A composite substrate made of a conductive pattern structure mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the conductive pattern structure. Metal lines are used for electrical coupling between the circuitry of the IC chip and the conductive pattern structure. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the conductive pattern structure and good heat distribution from the lead frame.

摘要翻译： 由安装在引线框架上的导电图案结构制成的复合基板用于电子系统封装。 高热产生的电子部件适于安装在引线框架上，并且相对低的热产生的电子部件适于安装在导电图案结构上。 金属线用于IC芯片的电路与导电图案结构之间的电耦合。 具有复合衬底的电子系统获得了两个优点 - 来自导电图案结构的良好的电路布置能力和来自引线框架的良好热分布。

公开(公告)号：US09484290B2

公开(公告)日：2016-11-01

申请号：US13969604

申请日：2013-08-18

申请人： CYNTEC CO., LTD.

发明人： Han-Hsiang Lee ,  Jeng-Jen Li ,  Kun-Hong Shih

IPC分类号： H05K5/02 ,  H01L23/495 ,  H05K1/02 ,  H05K7/14 ,  H01L23/13 ,  H02M3/00 ,  H05K3/00

CPC分类号： H01L23/49575 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K7/1432 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/1327

摘要： A composite substrate made of a conductive pattern structure mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the conductive pattern structure. Metal lines are used for electrical coupling between the circuitry of the IC chip and the conductive pattern structure. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the conductive pattern structure and good heat distribution from the lead frame.

摘要翻译： 由安装在引线框架上的导电图案结构制成的复合基板用于电子系统封装。 高热产生的电子部件适于安装在引线框架上，并且相对低的热产生的电子部件适于安装在导电图案结构上。 金属线用于IC芯片的电路与导电图案结构之间的电耦合。 具有复合衬底的电子系统获得了两个优点 - 来自导电图案结构的良好的电路布置能力和来自引线框架的良好热分布。