Invention Grant
- Patent Title: Resonance device and manufacturing method therefor
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Application No.: US15941095Application Date: 2018-03-30
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Publication No.: US10374569B2Publication Date: 2019-08-06
- Inventor: Keiichi Umeda , Takehiko Kishi , Hiroshi Yamada , Masakazu Fukumitsu
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2015-229069 20151124
- Main IPC: H03H3/007
- IPC: H03H3/007 ; H03H9/05 ; H03H3/04 ; H03H9/10 ; H03H9/24

Abstract:
A resonance device that includes a lower cover formed from non-degenerate silicon; a resonator having a degenerate silicon substrate with a lower surface facing the lower cover, and including first and second electrode layers laminated on the substrate with a piezoelectric film formed therebetween and having a surface opposing an upper surface of the substrate. Moreover, the lower surface of the substrate has an adjustment region where a depth or height of projections and recesses formed on the surface is larger than that in another region of the lower surface of the substrate or is a region where an area of the projections and recesses is larger than that in the other region of the lower surface of the substrate.
Public/Granted literature
- US20180226937A1 RESONANCE DEVICE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2018-08-09
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