Invention Grant
- Patent Title: Pop-up laminate structures with integrated electronics
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Application No.: US14909792Application Date: 2014-08-04
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Publication No.: US10376326B2Publication Date: 2019-08-13
- Inventor: Joshua B. Gafford , Samuel B. Kesner , Conor J. Walsh , Michael Karpelson , Robert J. Wood , Zivthan Dubrovsky , Benjamin I. Goldberg , Kathleen O'Donnell , Michael J. Smith
- Applicant: President and Fellows of Harvard College
- Applicant Address: US MA Cambridge
- Assignee: President and Fellows of Harvard College
- Current Assignee: President and Fellows of Harvard College
- Current Assignee Address: US MA Cambridge
- Agency: Modern Times Legal
- Agent Robert J. Sayre
- International Application: PCT/US2014/049588 WO 20140804
- International Announcement: WO2015/020952 WO 20150212
- Main IPC: B81B7/00
- IPC: B81B7/00 ; A61B34/00 ; B81C99/00 ; A61B18/14 ; H05K1/02 ; H05K1/18 ; A61B17/00 ; A61B17/29 ; A61B90/00 ; A61B18/00

Abstract:
A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.
Public/Granted literature
- US20160184041A1 Pop-Up Laminate Structures with Integrated Electronics Public/Granted day:2016-06-30
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