公开(公告)号：US20220361974A1

公开(公告)日：2022-11-17

申请号：US17866613

申请日：2022-07-18

Applicant: President and Fellows of Harvard College

Inventor： Joshua B. Gafford ,  Samuel B. Kesner ,  Conor J. Walsh ,  Michael Karpelson ,  Robert J. Wood ,  Zivthan Dubrovsky ,  Benjamin I. Goldberg ,  Kathleen O'Donnell ,  Michael J. Smith

IPC: A61B34/00 ,  B81C99/00 ,  A61B18/14 ,  B81B7/00 ,  H05K1/02 ,  H05K1/18

Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.

公开(公告)号：US11419693B2

公开(公告)日：2022-08-23

申请号：US16526411

申请日：2019-07-30

Applicant: President and Fellows of Harvard College

Inventor： Joshua B. Gafford ,  Samuel B. Kesner ,  Conor J. Walsh ,  Michael Karpelson ,  Robert J. Wood ,  Zivthan Dubrovsky ,  Benjamin I. Goldberg ,  Kathleen O'Donnell ,  Michael J. Smith

IPC: A61B34/00 ,  B81C99/00 ,  A61B18/14 ,  B81B7/00 ,  H05K1/02 ,  H05K1/18 ,  A61B17/00 ,  A61B17/29 ,  A61B90/00 ,  A61B18/00

Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.

公开(公告)号：US20200015920A1

公开(公告)日：2020-01-16

申请号：US16526411

申请日：2019-07-30

Applicant: President and Fellows of Harvard College

Inventor： Joshua B. Gafford ,  Samuel B. Kesner ,  Conor J. Walsh ,  Michael Karpelson ,  Robert J. Wood ,  Zivthan Dubrovsky ,  Benjamin I. Goldberg ,  Kathleen O'Donnell ,  Michael J. Smith

IPC: A61B34/00 ,  H05K1/18 ,  H05K1/02 ,  B81B7/00 ,  A61B18/14 ,  B81C99/00

Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.

公开(公告)号：US10376326B2

公开(公告)日：2019-08-13

申请号：US14909792

申请日：2014-08-04

Applicant: President and Fellows of Harvard College

Inventor： Joshua B. Gafford ,  Samuel B. Kesner ,  Conor J. Walsh ,  Michael Karpelson ,  Robert J. Wood ,  Zivthan Dubrovsky ,  Benjamin I. Goldberg ,  Kathleen O'Donnell ,  Michael J. Smith

IPC: B81B7/00 ,  A61B34/00 ,  B81C99/00 ,  A61B18/14 ,  H05K1/02 ,  H05K1/18 ,  A61B17/00 ,  A61B17/29 ,  A61B90/00 ,  A61B18/00

Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.

公开(公告)号：US20160184041A1

公开(公告)日：2016-06-30

申请号：US14909792

申请日：2014-08-04

Applicant: PRESIDENT AND FELLOWS OF HARVARD COLLEGE

Inventor： Joshua B. Gafford ,  Samuel B. Kesner ,  Conor J. Walsh ,  Michael Karpelson ,  Robert J. Wood ,  Zivthan Dubrovsky ,  Benjamin I. Goldberg ,  Kathleen O'Donnell ,  Michael J. Smith

IPC: A61B34/00 ,  A61B18/14 ,  H05K1/02 ,  H05K1/18 ,  B81B7/00 ,  B81C99/00

CPC classification number: A61B34/72 ,  A61B18/1442 ,  A61B18/148 ,  A61B2017/00039 ,  A61B2017/0011 ,  A61B2017/00203 ,  A61B2017/00345 ,  A61B2017/00402 ,  A61B2017/00526 ,  A61B2017/00867 ,  A61B2017/2926 ,  A61B2018/00577 ,  A61B2018/00595 ,  A61B2018/146 ,  A61B2090/064 ,  A61B2562/0261 ,  A61B2562/028 ,  B81B7/008 ,  B81B2207/99 ,  B81C99/0095 ,  H05K1/0278 ,  H05K1/18

Abstract: A multi-layer, super-planar laminate structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations. A layer with electrical wiring can be included in the structure for delivering electric current to devices on or in the laminate structure.

Abstract translation: 可以从明显图案化的层形成多层超平面层压结构。 结构中的层可以包括至少一个刚性层和至少一个柔性层; 刚性层包括多个刚性段，并且柔性层可以在刚性段之间延伸以用作接头。 然后将层层叠并结合在所选择的位置以形成具有层间结合的层压结构，并且层压结构在刚性段之间的柔性层处弯曲以产生扩展的三维结构，其中层在 选择的粘合位置并在其他位置分离。 具有电线的层可以包括在用于将电流传送到层压结构中或其中的装置的结构中。