Invention Grant
- Patent Title: 3D memory with staged-level multibit programming
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Application No.: US15290376Application Date: 2016-10-11
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Publication No.: US10381094B2Publication Date: 2019-08-13
- Inventor: Chen-Jun Wu , Chih-Chang Hsieh , Tzu-Hsuan Hsu , Hang-Ting Lue
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes Beffel & Wolfeld LLP
- Main IPC: G11C16/34
- IPC: G11C16/34 ; G11C16/04 ; G11C11/56 ; G11C16/10

Abstract:
A two-sided, staged programming operation is applied to a memory having first and second stacks of memory cells C1(i) and C2(i), i being the physical level of a cell. The staged programming operation includes applying a preliminary program stage S1, an intermediate program stage S2, and a final program stage S3 to memory cells in the first and second stacks. In a programming order the final program stage S3 is applied to memory cells in the first and second stacks at each level (i) for which the intermediate program stage S2 has already been applied to the memory cells in any neighboring levels (levels i+1 and i−1). The intermediate program stage S2 is applied only to memory cells for which the preliminary program stage S1 has already been applied to the cells in any neighboring levels (levels i+1 and i−1).
Public/Granted literature
- US20180102177A1 3D MEMORY WITH STAGED-LEVEL MULTIBIT PROGRAMMING Public/Granted day:2018-04-12
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