Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US15806481Application Date: 2017-11-08
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Publication No.: US10381246B2Publication Date: 2019-08-13
- Inventor: Satoshi Okamura , Satoshi Biwa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2016-223277 20161116
- Main IPC: B08B3/08
- IPC: B08B3/08 ; B08B7/00 ; H01L21/02 ; H01L21/67 ; H01L21/677

Abstract:
Disclosed is a substrate processing apparatus including: a container body configured to accommodate a substrate and perform a processing on the substrate using a high-pressure processing fluid; a conveyance port configured to carry the substrate into and out of the container body; an opening formed in the container body at a position different from the conveyance port; and a cover member configured to close the opening.
Public/Granted literature
- US20180138060A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2018-05-17
Information query
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