Invention Grant
- Patent Title: Integrated circuit package having an IC die between top and bottom leadframes
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Application No.: US15003238Application Date: 2016-01-21
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Publication No.: US10381293B2Publication Date: 2019-08-13
- Inventor: Lee Han Meng@Eugene Lee , Chong Han Lim , You Chye How
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L23/495
Abstract:
An integrated circuit (IC) package includes a first leadframe having a top surface and a bottom surface. An IC die has an active side coupled to the first leadframe bottom surface and has a back side. A second leadframe has a top surface and a bottom surface. The back side of said IC chip is coupled to the top surface of the second leadframe.
Public/Granted literature
- US20170213781A1 INTEGRATED CIRCUIT PACKAGE Public/Granted day:2017-07-27
Information query
IPC分类:
