Invention Grant
- Patent Title: Method of manufacturing printed-circuit board assembly
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Application No.: US14920513Application Date: 2015-10-22
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Publication No.: US10383235B2Publication Date: 2019-08-13
- Inventor: Jung-Je Bang , Mi-Jin Kim , Sae-Bom Lee , Hyun-Joo Han , Kun-Tak Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2014-0144242 20141023
- Main IPC: H05K3/32
- IPC: H05K3/32 ; H01L23/552 ; H01L23/00 ; H05K1/02 ; H05K3/34 ; H01L23/36 ; H01L23/10 ; H01L21/56 ; H01L23/373 ; H01L23/42 ; H01L23/427
Abstract:
A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.
Public/Granted literature
- US10426041B2 Method of manufacturing printed-circuit board assembly Public/Granted day:2019-09-24
Information query
