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公开(公告)号：US10426041B2
公开(公告)日：2019-09-24
申请号：US14920513
申请日：2015-10-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Je Bang , Mi-Jin Kim , Sae-Bom Lee , Hyun-Joo Han , Kun-Tak Kim
IPC: H05K3/32 , H01L23/552 , H01L23/00 , H05K1/02 , H05K3/34 , H01L23/36 , H01L23/10 , H01L21/56 , H01L23/373 , H01L23/42 , H01L23/427
Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.
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公开(公告)号：USRE48641E1
公开(公告)日：2021-07-13
申请号：US16287888
申请日：2019-02-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ki-Youn Jang , Kyung-Ha Koo , Kun-Tak Kim , Ki-Cheol Bae , Hyun-Deok Seo , Hyun-Tae Jang , Jong-Chul Choi
Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.
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Patent Agency Ranking
公开(公告)号：US10197457B2
公开(公告)日：2019-02-05
申请号：US14289166
申请日：2014-05-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ki-Youn Jang , Min-Su Kim , Kun-Tak Kim , Chi-Hyun Cho
Abstract: A method and apparatus for determining a control temperature to control a function of an electronic device by using an atmospheric temperature when controlling a temperature of the electronic device, and for controlling the function of the electronic device according to a control step of the determined control temperature are provided. A method of operating an electronic device includes measuring an atmospheric temperature, determining at least one control temperature corresponding to the measured atmospheric temperature, measuring an internal temperature of the electronic device, and controlling a function in accordance with the measured internal temperature of the electronic device and the determined at least one control temperature.
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公开(公告)号：US20160120039A1
公开(公告)日：2016-04-28
申请号：US14920513
申请日：2015-10-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Je BANG , Mi-Jin Kim , Sae-Bom Lee , Hyun-Joo Han , Kun-Tak Kim
CPC classification number: H05K3/321 , H01L21/563 , H01L23/10 , H01L23/36 , H01L23/3737 , H01L23/42 , H01L23/4275 , H01L23/552 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/29194 , H01L2224/32225 , H01L2224/32245 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2224/83191 , H01L2224/83855 , H01L2224/92125 , H01L2224/9221 , H01L2224/92225 , H01L2924/1421 , H01L2924/16152 , H01L2924/16235 , H01L2924/16251 , H01L2924/19105 , H01L2924/3025 , H05K1/0203 , H05K1/0216 , H05K1/023 , H05K3/341 , H05K3/3494 , H05K2201/066 , H05K2201/10371 , H05K2201/1056 , Y02P70/613 , H01L2924/00
Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.
Abstract translation: 提供了制造印刷电路板组件的方法。 一种方法包括在安装在印刷电路板上的加热部件上施加液化辐射热材料; 将屏蔽单元安装在与液化辐射热材料接触的印刷电路板上; 同时固化液化的辐射热材料并粘合屏蔽单元。
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公开(公告)号：US20150241935A1
公开(公告)日：2015-08-27
申请号：US14626664
申请日：2015-02-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ki-Youn Jang , Kyung-Ha Koo , Kun-Tak Kim , Ki-Cheol Bae , Hyun-Deok Seo , Hyun-Tae Jang , Jong-Chul Choi
CPC classification number: G06F1/203 , G06F1/1626 , G06F1/1635 , G06F1/1684
Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.
Abstract translation: 提供具有辐射功能的移动通信终端。 移动通信终端包括：显示模块; 后盖; 位于所述显示模块和所述后盖之间并且包括面对所述显示模块的第一表面和面向所述显示模块的相对侧的第二表面的内部支撑结构; 位于支撑结构的第一表面和显示模块之间的第一辐射热片; 位于第一辐射热片与支撑结构的第一表面之间的印刷电路板; 以及位于所述支撑结构的第二表面和所述后盖之间的第二辐射热片。
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公开(公告)号：US10383235B2
公开(公告)日：2019-08-13
申请号：US14920513
申请日：2015-10-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Je Bang , Mi-Jin Kim , Sae-Bom Lee , Hyun-Joo Han , Kun-Tak Kim
IPC: H05K3/32 , H01L23/552 , H01L23/00 , H05K1/02 , H05K3/34 , H01L23/36 , H01L23/10 , H01L21/56 , H01L23/373 , H01L23/42 , H01L23/427
Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.
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公开(公告)号：US09582051B2
公开(公告)日：2017-02-28
申请号：US14626664
申请日：2015-02-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ki-Youn Jang , Kyung-Ha Koo , Kun-Tak Kim , Ki-Cheol Bae , Hyun-Deok Seo , Hyun-Tae Jang , Jong-Chul Choi
CPC classification number: G06F1/203 , G06F1/1626 , G06F1/1635 , G06F1/1684
Abstract: A mobile communication terminal with a radiant-heat function is provided. The mobile communication terminal includes: a display module; a rear cover; an inner support structure positioned between the display module and the rear cover and including a first surface facing the display module and a second surface facing an opposite side to the display module; a first radiant-heat sheet positioned between the first surface of the support structure and the display module; a printed circuit board positioned between the first radiant-heat sheet and the first surface of the support structure; and a second radiant-heat sheet positioned between the second surface of the support structure and the rear cover.
Abstract translation: 提供具有辐射功能的移动通信终端。 所述移动通信终端包括：显示模块; 后盖; 位于所述显示模块和所述后盖之间并且包括面对所述显示模块的第一表面和面向所述显示模块的相对侧的第二表面的内部支撑结构; 位于支撑结构的第一表面和显示模块之间的第一辐射热片; 位于第一辐射热片与支撑结构的第一表面之间的印刷电路板; 以及位于所述支撑结构的第二表面和所述后盖之间的第二辐射热片。
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