Invention Grant
- Patent Title: Base for back grind tapes, and back grind tape
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Application No.: US15302419Application Date: 2015-04-10
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Publication No.: US10388556B2Publication Date: 2019-08-20
- Inventor: Yuki Morita , Yosuke Saito , Shigeto Okuji
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Itabashi-ku
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Itabashi-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-082213 20140411
- International Application: PCT/JP2015/061225 WO 20150410
- International Announcement: WO2015/156389 WO 20151015
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B32B27/30 ; B32B27/40 ; C09J7/29
Abstract:
A substrate for back grind tape of the present invention includes a substrate film having a Young's modulus of 600 MPa or more; and a buffer layer provided on one face of the substrate film, the buffer layer formed of a urethane-containing cured material and having a peak temperature of tan δ of 60° C. or lower.
Public/Granted literature
- US20170025303A1 BASE FOR BACK GRIND TAPES, AND BACK GRIND TAPE Public/Granted day:2017-01-26
Information query
IPC分类:
